IP Library Granted Patent US 9,190,207
Granted Patent B2
US 9,190,207 · App. 13/871,767 · Granted Nov 17, 2015

Multilayer ceramic electronic component having external electrodes which include a metal layer and conductive resin layer

Inventors: Kyung Pyo Hong (Gyunggi-do, KR); Byung Jun Jeon (Gyunggi-do, KR); Byoung Jin Chun (Gyunggi-do, KR); Jae Hwan Han (Gyunggi-do, KR)
Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
H01G4/008H01G4/2325H01G4/30H01G4/12
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Quick Facts
Patent No.
US 9,190,207
App. No.
13/871,767
Granted
Nov 17, 2015
Kind
B2
Abstract

There is provided a multilayer ceramic electronic component, including a ceramic body including dielectric layers; a plurality of internal electrodes stacked within the ceramic body, and external electrodes formed on external surfaces of the ceramic body and electrically connected to the internal electrodes, wherein the external electrodes include a metal layer and a conductive resin layer formed on the metal layer, the conducive resin layer containing a copper powder and an epoxy resin, the copper powder including a first copper powder having a content of 10 wt % or more and a particle diameter of 2 μm or greater and a second copper powder having a content of 5 wt % or more and a particle diameter of 0.7 μm or smaller, the first copper powder being a mixture of spherical powder particles and flake type powder particles.

Claims (22)

1. A multilayer ceramic electronic component, comprising:

a ceramic body including dielectric layers;

a plurality of internal electrodes stacked within the ceramic body; and

external electrodes formed on external surfaces of the ceramic body and electrically connected to the internal electrodes,

wherein the external electrodes include a metal layer directly connected to the internal electrodes and a conductive resin layer formed on the metal layer and connected to the internal electrodes via the metal layer,

the metal layer including glass materials, and

the conductive resin layer containing a copper powder and an epoxy resin, the copper powder including a first copper powder having a content of 10 wt % or more in the conductive resin layer and a particle diameter of 2 μm or greater and a second copper powder having a content of 5 wt % or more in the conductive resin layer and a particle diameter of 0.7 μm or smaller, the first copper powder being a mixture of spherical powder particles and flake type powder particles.

2. The multilayer ceramic electronic component of claim 1 , wherein in the first copper powder, a content of the spherical powder particles is equal to or greater than a content of the flake type powder particles.

3. The multilayer ceramic electronic component of claim 1 , wherein the spherical powder particles have a major axis to minor axis length ratio (major axis/minor axis) of 1.45 or smaller.

4. The multilayer ceramic electronic component of claim 1 , wherein the flake type powder particles have a major axis to minor axis length ratio (major axis/minor axis) of 1.95 or greater.

5. The multilayer ceramic electronic component of claim 1 , wherein an equivalent series resistance (ESR) of the multilayer ceramic electronic component satisfies 0.1 mΩ≦ESR≦30 mΩ.

6. A multilayer ceramic electronic component, comprising:

a ceramic body including dielectric layers;

a plurality of internal electrodes stacked within the ceramic body; and

external electrodes formed on external surfaces of the ceramic body and electrically connected to the internal electrodes,

wherein the external electrodes include a metal layer directly connected to the internal electrodes and a conductive resin layer formed on the metal layer and connected to the internal electrodes via the metal layer,

the metal layer including glass materials, and

the conductive resin layer containing a copper powder and an epoxy resin, the copper powder including a first copper powder having a particle diameter of 2 μm or greater and a second copper powder having a particle diameter of 0.7 μm or smaller, the first copper powder being a mixture of spherical powder particles and flake type powder particles, an area occupied by the first copper powder in the conductive resin layer being 10% or more, and an area occupied by the second copper powder in the conductive resin layer being 5% or more.

7. The multilayer ceramic electronic component of claim 6 , wherein in the first copper powder, an area occupied by the spherical powder particles in the external electrodes is equal to or greater than an area occupied by the flake type powder particles in the external electrodes.

8. The multilayer ceramic electronic component of claim 6 , wherein the spherical powder particles have a major axis to minor axis length ratio (major axis/minor axis) of 1.45 or smaller.

9. The multilayer ceramic electronic component of claim 6 , wherein the flake type powder particles have a major axis to minor axis length ratio (major axis/minor axis) of 1.95 or greater.

10. The multilayer ceramic electronic component of claim 6 , wherein an equivalent series resistance (ESR) of the multilayer ceramic electronic component satisfies 0.1 mΩ≦ESR≦30 mΩ.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 26, 2013
From: HONG, KYUNG PYO; JEON, BYUNG JUN; CHUN, BYOUNG JIN; HAN, JAE HWAN
To: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Reel/Frame 030299/0685 →
Priority Claims (1)
KR 10-2013-0018273 · Feb 20, 2013 · national
Continuity (1)
Related Publication 20140233147A1 · Aug 21, 2014