IP Library › Granted Patent US 9,190,976
Granted Patent B2
US 9,190,976 · App. 13/804,206 · Granted Nov 17, 2015

Passive device cell and fabrication process thereof

Inventors: Ming-Tzong Yang (Baoshan Township, Hsinchu County, TW); Cheng-Chou Hung (Hukou Township, Hsinchu County, TW); Tung-Hsing Lee (New Taipei, TW); Wei-Che Huang (Zhudong Township, Hsinchu County, TW)
Assignee: MEDIATEK INC.
H03H7/0115H01P1/20381H01P7/082H03H3/00
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Quick Facts
Patent No.
US 9,190,976
App. No.
13/804,206
Granted
Nov 17, 2015
Kind
B2
Abstract

An embodiment of the invention provides a passive device cell. The passive device cell has a substrate layer, a passive device, and an intermediary layer formed between the substrate layer and the passive device. The intermediary layer includes a plurality of LC resonators.

Claims (24)

1. A passive device cell, comprising:

a substrate layer;

an intermediary layer formed above the substrate layer, the intermediary layer comprising a plurality of LC resonators; and

a passive device formed above the intermediary layer, wherein the size of each of the plurality of LC resonators is more than 100 times smaller than the size of the passive device.

2. The passive device cell of claim 1 , wherein the plurality of LC resonators constitute a two dimensional array in the intermediary layer.

3. The passive device cell of claim 1 , wherein each of the plurality of LC resonators comprises a pair of conductive components adjacent to and electrically isolated from each other.

4. The passive device cell of claim 3 , wherein the pair of conductive components of each of the plurality of LC resonators are a pair of conductive split-rings, each of the conductive split-rings has a split, the two splits of the respective pair of conductive split-rings face two opposite directions, and one of the respective pair of conductive split-rings is substantially encircled by the other.

5. The passive device cell of claim 1 , wherein the intermediary layer further comprises a plurality of pairs of segmented conductive lines, each of the plurality of pairs of segmented conductive lines comprises a first segmented conductive line and a second segmented conductive line beside and substantially parallel to each other, and gaps between the first segmented conductive line are not aligned with gaps between the second segmented conductive line.

6. A passive device cell, comprising:

a substrate layer;

a metamaterial layer formed above the substrate layer, the metamaterial layer comprising a plurality of LC resonators; and

a passive device formed above the metamaterial layer, wherein the size of each of the plurality of LC resonators is more than 100 times smaller than the size of the passive device.

7. The passive device cell of claim 6 , wherein the plurality of LC resonators constitute a two dimensional array in the metamaterial layer.

8. The passive device cell of claim 6 , wherein the metamaterial layer further comprises a plurality of pairs of segmented conductive lines, each of the plurality of pairs of segmented conductive lines comprises a first segmented conductive line and a second segmented conductive line beside and substantially parallel to each other, and gaps between the first segmented conductive line are not aligned with gaps between the second segmented conductive line.

9. The passive device cell of claim 6 , wherein each of the plurality of LC resonators is a split-ring resonator.

10. The passive device cell of claim 9 , wherein the split-ring resonator of each of the plurality of LC resonators comprises a pair of conductive split-rings, and each of the conductive split-rings has a split.

11. The passive device cell of claim 10 , wherein the two splits of the respective pair of conductive split-rings face two opposite directions, and one of the respective pair of conductive split-rings is substantially encircled by the other.

12. A passive device fabrication process, comprising:

forming an intermediary layer above a substrate layer, the intermediary layer comprising a plurality of LC resonators; and

forming a passive device above the intermediary layer, wherein the size of each of the plurality of LC resonators is more than 100 times smaller than the size of the passive device.

13. The process of claim 12 , wherein each of the plurality of LC resonators comprises a pair of conductive components adjacent to and electrically isolated from each other.

14. The process of claim 13 , wherein the pair of conductive components of each of the plurality of LC resonators are a pair of conductive split-rings, each of the conductive split-rings has a split, the two splits of the respective pair of conductive split-rings face two opposite directions, and one of the respective pair of conductive split-rings is substantially encircled by the other.

15. The process of claim 12 , wherein the intermediary layer further comprises a plurality of pairs of segmented conductive lines, each of the plurality of pairs of segmented conductive lines comprises a first segmented conductive line and a second segmented conductive line beside and substantially parallel to each other, and gaps between the first segmented conductive line are not aligned with gaps between the second segmented conductive line.

16. The process of claim 12 , wherein the plurality of LC resonators constitute a two dimensional array in the intermediary layer.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 14, 2013
From: YANG, MING-TZONG; HUNG, CHENG-CHOU; LEE, TUNG-HSING; HUANG, WEI-CHE
To: MEDIATEK INC.
Reel/Frame 030003/0132 →
Continuity (2)
Provisional Application 61622310 · Apr 10, 2012
Related Publication 20130265121A1 · Oct 10, 2013