Method of manufacturing thin film transistor substrate and thin film transistor substrate manufactured by the method
The present invention includes at least a step forming a source electrode ( 32 ) and a drain electrode ( 33 ), each of which is a multilayer film of a first conductive film ( 32 a ), ( 33 a ) made of titanium or molybdenum, a second conductive film ( 32 b ), ( 33 b ) made of copper, and a third conductive film ( 32 c ), ( 33 c ) made of titanium oxide, a step of forming passivation film ( 18 ), which is an inorganic insulating film, on an oxide semiconductor layer ( 13 ), the source electrode ( 32 ) and drain electrode ( 33 ), and an annealing step of annealing the oxide semiconductor layer ( 13 ).
1. A method of manufacturing a thin film transistor substrate including
an insulating substrate,
an oxide semiconductor layer provided on the insulating substrate and having a channel region,
a source electrode and a drain electrode provided on the oxide semiconductor layer to face one another with the channel region interposed therebetween, and
a passivation film covering the oxide semiconductor layer, the source electrode, and the drain electrode,
the method comprising at least:
a semiconductor layer forming step of forming the oxide semiconductor layer on the insulating substrate;
a metal film forming step of forming a first conductive film provided on the oxide semiconductor layer and made of titanium or molybdenum, a second conductive film provided on the first conductive film and made of copper, and a copper-titanium alloy film provided on the second conductive film and containing titanium within a range from 20 at % to 50 at %, both inclusive;
a passivation film forming step of forming a passivation film which is an inorganic insulating film on the oxide semiconductor layer, the first conductive film, the second conductive film, and the copper-titanium alloy film; and
a source/drain forming step of forming the source electrode and the drain electrode, each of which is a multilayer film of the first conductive film, the second conductive film, and a third conductive film including the copper-titanium alloy film and a titanium oxide film, by annealing the oxide semiconductor layer, and forming the titanium oxide film on the surface of the copper-titanium alloy film by the annealing.
2. The method of claim 1 , wherein
the oxide semiconductor layer is made of metal oxide containing at least one selected from the group consisting of indium (In), gallium (Ga), aluminum (Al), copper (Cu), and zinc (Zn).
3. The method of claim 2 , wherein
the oxide semiconductor layer is made of indium gallium zinc oxide.
4. A thin film transistor substrate manufactured by the method of claim 1 .
5. A thin film transistor substrate manufactured by the method of claim 2 .