Method of manufacturing light emitting device, and light emitting device
A method of manufacturing a light emitting device includes: disposing a group of electrically conductive members on a support substrate, the group of the electrically conductive members forming a plurality of mounting portions arranged in two or more columns and two or more rows with the mounting portions respectively corresponding to a plurality of light emitting elements; placing the light emitting elements on the group of the electrically conductive members with a bonding member being disposed between the light emitting elements and the electrically conductive members, each of the light emitting elements being shifted from a corresponding one of the mounting portions; and melting the bonding member to mount the light emitting elements respectively on the mounting portions by self-alignment effect generated by the melting of the bonding member.
1. A light emitting device comprising:
a support substrate having a group of electrically conductive members disposed thereon; and
three or more light emitting elements mounted on the group of the electrically conductive members,
the group of electrically conductive members forming a plurality of mounting portions arranged in two or more columns and two or more rows, with each of the light emitting elements being respectively mounted on a corresponding one of the mounting portions via a bonding member so that the light emitting elements are disposed adjacent to each other after the light emitting elements are shifted toward each other both in a column direction and in a row direction by self-alignment of the bonding member, the electrically conductive members being arranged into a plurality of electrode pairs respectively corresponding to the mounting portions, with each of the electrode pairs including a positive electrode and a negative electrode, and a planar dimension of the positive electrode and the negative electrode in each of the electrode pairs being the same or smaller than a planar dimension of a corresponding one of the light emitting elements.
2. The light emitting device according to claim 1 , wherein
each of the light emitting elements is respectively mounted on the corresponding one of the mounting portions along a corresponding one of hypothetical lines extending in radial directions from an approximate center of the group of the electrically conductive members.
3. The light emitting device according to claim 1 , wherein
the group of the electrically conductive members further forms a plurality of extended portions with each of the extended portions connecting adjacent ones of the mounting portions or extended from one of the mounting portions.
4. The light emitting device according to claim 1 , wherein
each of the electrode pairs corresponding to each of the mounting portions has the planar dimension equal to or up to 10% smaller than the planar dimension of an electrode part of the corresponding one of the light emitting elements.
5. The light emitting device according to claim 1 , wherein
each of the light emitting elements has a fluorescent material layer.
6. The light emitting device according to claim 1 , wherein
the light emitting elements are sealed with a light transmissive sealing member.
7. The light emitting device according to claim 6 , wherein the sealing member contains a fluorescent material.
8. The light emitting device according to claim 1 , wherein
an underfill is disposed between the light emitting elements and the support substrate.
9. The light emitting device according to claim 8 , wherein
the underfill contains a reflective material.
10. The light emitting device according to claim 1 , wherein
a distance between adjacent ones of the light emitting elements is less than 20 μm.
11. The light emitting device according to claim 1 , wherein
surfaces of the electrically conductive members include traces caused by shifting of the light emitting elements by the self-alignment of the bonding member.