Semiconductor device
A semiconductor device includes a semiconductor element in the form of a flat plate that has opposed first and second surfaces, an insulating layer that covers control wiring located on the first surface side of the semiconductor element, a metal block that is bonded to the first surface side of the semiconductor element via a solder layer, and a protective film that is formed between the metal block and the insulating layer, the protective film having a hardness equal to or greater than a hardness of the metal block. When viewed from the first surface side, the protective film is formed in an area at least including a position where an edge portion of the metal block and the control wiring cross each other.
1. A semiconductor device comprising:
a semiconductor element in a form of a flat plate, the semiconductor element having opposed first and second surfaces;
a control wiring;
an insulating layer that covers the control wiring located on a first surface side of the semiconductor element;
a solder layer;
a metal block that is bonded to the first surface side of the semiconductor element via the solder layer; and
a protective film that is formed between the metal block and the insulating layer, the protective film having a hardness equal to or greater than a hardness of the metal block,
wherein:
when viewed from the first surface side, the protective film is formed at least at a position where an edge portion of the metal block and the control wiring cross each other,
the protective film is provided in a predetermined area in a shape of a rectangular frame with a predetermined width, which lies along an outer edge of the metal block, and
the protective film defines a plurality of openings that are configured to release degas from the insulating layer.
2. The semiconductor device according to claim 1 , wherein when viewed from the first surface side, the protective film is formed in a predetermined area including the position where the edge portion of the metal block and the control wiring cross each other.
3. The semiconductor device according to claim 2 , further comprising:
a main electrode to which the solder layer is bonded and which includes a plurality of electrode portions; and
a bonding film,
wherein the control wiring is located between adjacent electrode portions of the plurality of electrode portions;
the insulating layer has a plurality of openings corresponding to the plurality of electrode portions; and
the bonding film is formed in each of the plurality of openings and is located between the solder layer and each of the plurality of electrode portions.
4. The semiconductor device according to claim 3 , wherein the bonding film and the protective film are formed integrally.
5. The semiconductor device according to claim 3 , wherein the protective film is formed of the same material as the bonding film.
6. The semiconductor device according to claim 1 , wherein the protective film is formed using a material selected from a group consisting of a Cu-based alloy, an Al-based alloy, Pd, Ag, Au, and Pt.