3D-camera and method for the three-dimensional monitoring of a monitoring area

1. A 3D-camera ( 10 ) having at least one image sensor ( 14 a - b ) and at least one illumination unit ( 100 ) which comprises a light source and which is configured for generating an irregular illumination pattern ( 20 ) in an illumination area ( 12 ) of the 3D-camera ( 10 ), wherein the light source comprises a semiconductor array ( 104 ) having a plurality of individual emitter elements ( 106 ) in an irregular arrangement, wherein a respective individual emitter element ( 106 ) generates a pattern element ( 112 ) of the irregular illumination pattern ( 20 ), wherein each individual emitter element ( 106 ) comprises a point-like emitter surface, and wherein the pattern element ( 112 ) generated by the individual emitter element ( 106 ) comprises a shape of the emitter surface.

2. The 3D-camera ( 10 ) according to claim 1 ,

wherein the semiconductor array ( 104 ) is a VCSEL array.

3. The 3D-camera ( 10 ) according to claim 1 ,

wherein the semiconductor array ( 104 ) comprises a large number of at least a thousand, ten thousand, or a hundred thousand individual emitter elements ( 106 ).

4. The 3D-camera ( 10 ) according to claim 1 ,

wherein the point-like emitter surfaces have at least one of mutually different shapes and sizes.

5. The 3D-camera ( 10 ) according to claim 1 ,

wherein the individual emitter elements ( 106 ) form at least two groups ( 106 a - b ), and wherein a group ( 106 a - b ) of individual emitter elements ( 106 ) can be activated without activating the remaining groups ( 106 a - b ) of individual emitter elements ( 106 ).

6. The 3D-camera ( 10 ) according to claim 1 ,

wherein the individual emitter elements ( 106 ) are controllable with mutually different currents.

7. The 3D-camera ( 10 ) according to claim 1 ,

wherein the density of the individual emitter elements ( 106 ) on the semiconductor array ( 104 ) varies.

8. The 3D-camera ( 10 ) according to claim 1 ,

wherein the arrangement of the pattern elements ( 112 ) in the illumination pattern ( 20 ) corresponds to the arrangement of the individual emitter elements ( 106 ) on the semiconductor array ( 104 ).

9. The 3D-camera ( 10 ) according to claim 1 ,

wherein the illumination unit ( 100 ) comprises an imaging objective to image the illumination pattern ( 20 ) from the near field at the semiconductor array ( 104 ) into the monitoring area ( 12 ).

10. The 3D-camera ( 10 ) according to claim 9 ,

wherein imaging objective and semiconductor array ( 104 ) are arranged mutually movable to image different subsets of individual emitter elements ( 106 ).

11. The 3D-camera ( 10 ) according to claim 1 ,

wherein a microlens array is arranged in front of the semiconductor array ( 104 ).

12. The 3D-camera ( 10 ) according to claim 11 ,

wherein the microlenses have the same irregular arrangement on the microlens array as the individual emitter elements ( 106 ) on the semiconductor array ( 104 ).

13. The 3D-camera ( 10 ) according to claim 1 ,

which is made as a stereo camera and comprises an evaluation unit ( 22 ) configured for the application of a stereo algorithm which, for generating a three-dimensional distance image, detects partial regions corresponding to one another in the two images of the monitoring area ( 12 ) illuminated by the illumination pattern ( 20 ) and captured by the two cameras of the stereo camera, and calculates the distances from their disparity.

14. The 3D-camera ( 10 ) according to claim 1 ,

which is made as a safety camera, wherein the evaluation unit ( 22 ) is configured to detect forbidden intrusions into the monitoring area ( 12 ) and to thereupon generate a shutdown signal, and wherein a safety output ( 26 ) is provided to output a shutdown signal to a monitored machine.

15. A method for the three-dimensional monitoring of a monitoring area ( 12 ),

wherein an illumination unit ( 100 ) generates an irregular illumination pattern ( 20 ) in the monitoring area ( 12 ), wherein a 3D-camera ( 10 ) captures images of the illuminated monitoring area ( 12 ), wherein a plurality of individual light beams ( 110 ) is transmitted by a corresponding plurality of individual emitter elements ( 106 ) on a semiconductor array ( 104 ), wherein the individual emitter elements ( 106 ) are arranged irregularly on the semiconductor array ( 104 ) and the bundle of individual light beams ( 110 ) leads to the irregular illumination pattern ( 20 ) due to the irregular arrangement, wherein a respective individual emitter element ( 106 ) generates a point-like pattern element ( 112 ) of the illumination pattern ( 20 ) via its individual light beam ( 110 ), wherein each individual emitter element ( 106 ) comprises a point-like emitter surface, and wherein the pattern element ( 112 ) generated by the individual emitter element ( 106 ) comprises a shape of the emitter surface.