Multilayer ceramic capacitor and method of manufacturing the same

1. A multilayer ceramic capacitor, comprising:

a ceramic body including a plurality of dielectric layers;

first and second internal electrodes facing each other while having at least one dielectric layer disposed therebetween, and alternately exposed to end surfaces of the ceramic body; and

first and second external electrodes electrically connected to the first and second internal electrodes, respectively,

wherein each of the first and second external electrodes includes:

a first external electrode layer formed of a material containing copper and glass and extending from an end surface of the ceramic body to portions of main and side surfaces of the ceramic body;

a second external electrode layer formed of a material containing glass, disposed on the first external electrode layer, and being shorter than the first external electrode layer to expose a portion of the first external electrode layer; and

a third external electrode layer formed of a material containing copper and glass and covering the first and second external electrode layers.

2. The multilayer ceramic capacitor of claim 1 , wherein a width of a band of the second external electrode layer is equal to or greater than 3 μm from the end surface of the ceramic body and is less than a width of a band of the first external electrode layer by 10 μm or more.

3. The multilayer ceramic capacitor of claim 1 , wherein the second external electrode layer contains copper, and

a content of glass in the second external electrode layer is 60 vol % or higher.

4. The multilayer ceramic capacitor of claim 1 , further comprising a plating layer disposed on the third external electrode layer.

5. A method of manufacturing a multilayer ceramic capacitor, the method comprising:

preparing a laminate by stacking a plurality of ceramic sheets having first and second internal electrodes formed thereon while the first and second internal electrodes face each other, having at least one ceramic sheet interposed therebetween, and pressing the stacked sheets;

cutting the laminate into chips each corresponding to a capacitor and sintering the same to obtain a ceramic body; and

forming first and second external electrodes on the ceramic body to be connected to the first and second internal electrodes, respectively,

wherein the forming of the first and second external electrodes includes:

forming a first external electrode layer using a conductive paste containing copper and glass to extend from an end surface of the ceramic body to portions of main and side surfaces of the ceramic body;

forming a second external electrode layer on the first external electrode layer using a paste containing glass, the second external electrode layer being shorter than the first external electrode layer so that a portion of the first external electrode layer is exposed; and

forming a third external electrode layer using a conductive paste containing copper and glass so as to cover the first and second external electrode layers.

6. The method of claim 5 , wherein a width of a band of the second external electrode layer is equal to or greater than 3 μm from the end surface of the ceramic body and is less than a width of a band of the first external electrode layer by 10 μm or more.

7. The method of claim 5 , wherein the second external electrode layer contains copper, and

a content of glass in the second external electrode layer is 60 vol % or higher.

8. The method of claim 5 , further comprising performing plating on a surface of the third external electrode layer after the forming of the third external electrode layer.