Monolithic FBAR-CMOS structure such as for mass sensing
An apparatus comprises a thin-film bulk acoustic resonator such as including an acoustic mirror, a piezoelectric region acoustically coupled to the acoustic mirror, and first and second conductors electrically coupled to the piezoelectric region. In an example, an integrated circuit substrate can include an interface circuit connected to the first and second conductors of the resonator, the integrated circuit substrate configured to mechanically support the resonator. An example can include an array of such resonators co-integrated with the interface circuit and configured to detect a mass change associated with one or more of a specified protein binding, a specified antibody-antigen coupling, a specified hybridization of a DNA oligomer, or an adsorption of specified gas molecules.
1. An apparatus, comprising:
a thin-film bulk acoustic resonator comprising:
an acoustic mirror;
a piezoelectric region acoustically coupled to the acoustic mirror;
a first conductor electrically coupled to the piezoelectric region; and
a second conductor electrically coupled to the piezoelectric region and electrically insulated from the first conductor;
a CMOS integrated circuit substrate including an interface circuit, the first and second conductors electrically coupled to the interface circuit;
wherein the thin-film bulk acoustic resonator is solidly-mounted to the CMOS integrated circuit substrate along an entire surface of the resonator,
wherein the thin-film bulk acoustic resonator is monolithically integrated to the CMOS integrated circuit substrate;
wherein the integrated circuit substrate is configured to mechanically support the resonator; and
wherein the acoustic mirror is configured to inhibit or prevent coupling of acoustic energy from the piezoelectric region into the integrated circuit substrate at or near a resonant frequency of the thin-film bulk acoustic resonator.
2. The apparatus of claim 1 , wherein the piezoelectric region comprises zinc oxide.
3. The apparatus of claim 1 , wherein the acoustic mirror comprises alternating layers of tungsten and silicon dioxide.
4. The apparatus of claim 3 , wherein the resonator is located on a top surface of the integrated circuit.
5. The apparatus of claim 1 , comprising an oscillator including the acoustic resonator and at least a portion of the interface circuit.
6. The apparatus of claim 5 , wherein an operating frequency of the oscillator is determined at least in part by a mass loading the piezoelectric region.
7. The apparatus of claim 6 , wherein the resonator comprises a sensing surface configured to detect at least one of a specified protein binding, a specified antibody-antigen coupling, a specified hybridization of a DNA oligomer, or an adsorption of specified gas molecules.
8. The apparatus of claim 7 , wherein the sensing surface is functionalized to adsorb gas molecules.
9. The apparatus of claim 7 , wherein the sensing surface includes an immobilized antibody, an antibody fragment, or a nucleic acid probe.
10. The apparatus of claim 7 , wherein the sensing surface is configured to increase in mass in response to at least one of a specified protein binding, a specified antibody-antigen coupling, a specified hybridization of a DNA oligomer, or an adsorption of specified gas molecules.
11. The apparatus of claim 5 , wherein the oscillator is configured to operate using a shear mode of mechanical oscillation of the resonator.
12. The apparatus of claim 5 , wherein the oscillator is configured to oscillate at the specified operating frequency when the apparatus is in contact with or surrounded by a liquid medium.
13. The apparatus of claim 5 , wherein the integrated circuit comprises a frequency counter coupled to the oscillator and configured to provide information indicative of an oscillation frequency of the oscillator.
14. An apparatus, comprising:
a thin-film bulk acoustic resonator array, each resonator comprising:
an acoustic mirror;
a piezoelectric region acoustically coupled to the acoustic mirror;
a first conductor electrically coupled to the piezoelectric region; and
a second conductor electrically coupled to the piezoelectric region and electrically insulated from the first conductor;
a CMOS integrated circuit substrate including an interface circuit, the first and second conductors of each resonator electrically coupled to the interface circuit;
wherein the thin-film bulk acoustic resonator array is solidly-mounted to the CMOS integrated circuit substrate along an entire surface of the resonator,
wherein the thin-film bulk acoustic resonator is and monolithically integrated to the CMOS integrated circuit substrate;
wherein the integrated circuit substrate is configured to mechanically support the resonator array;
wherein each respective acoustic mirror is configured to reduce or inhibit coupling of acoustic energy from the respective piezoelectric region into the integrated circuit substrate at or near a resonant frequency of the respective thin-film bulk acoustic resonator including the respective acoustic mirror; and
wherein the array comprises an array of oscillators, each oscillator including at least one acoustic resonator and at least a portion of the interface circuit.
15. The apparatus of claim 14 , wherein an operating frequency of each oscillator is determined at least in part by a mass loading each piezoelectric region.
16. The apparatus of claim 14 , wherein the integrated circuit comprises a frequency counter coupled to at least one oscillator included in the array, and configured to provide information indicative of an oscillation frequency of the at least one oscillator.
17. The apparatus of claim 14 , wherein each piezoelectric region comprises zinc oxide.
18. The apparatus of claim 14 , wherein each acoustic mirror comprises alternating layers of tungsten and silicon dioxide.
19. The apparatus of claim 14 , wherein each resonator is located on a top surface of the integrated circuit.
20. The apparatus of claim 15 , wherein at least one oscillator included in the array includes a resonator comprising a sensing surface that is configured to detect at least one of a specified protein binding, a specified antibody-antigen coupling, a specified hybridization of a DNA oligomer, or an adsorption of specified gas molecules.
21. The apparatus of claim 20 , wherein the sensing surface is functionalized to adsorb gas molecules.
22. The apparatus of claim 20 , wherein the sensing surface includes an immobilized antibody, an antibody fragment, or a nucleic acid probe.
23. The apparatus of claim 20 , wherein the sensing surface is configured to increase in mass in response to at least one of a specified protein binding, a specified antibody-antigen coupling, a specified hybridization of a DNA oligomer, or an adsorption of specified gas molecules.
24. The apparatus of claim 14 , wherein each oscillator is configured to operate using a shear mode of mechanical oscillation of each resonator.
25. The apparatus of claim 14 , wherein each oscillator is configured to oscillate at the specified operating frequency when the apparatus is in contact with or surrounded by a liquid medium.