Adhesion-promoting composition used between curable composition for imprints and substrate, and semiconductor device using the same
Provided is an adhesion-promoting composition between a curable composition for imprints and a substrate, which excellent in adhesiveness and can control pattern failure. An adhesion-promoting composition used between a curable composition for imprints and a substrate, which comprises a compound having a molecular weight of 500 or larger and having a reactive group, and has a content of a compound, with a molecular weight of 200 or smaller, of more than 1% by mass and not more than 10% by mass of a total solid content.
1. An adhesion-promoting composition used between a curable composition for imprints and a substrate,
which comprises a compound having a molecular weight of 500 or larger and having a reactive group, and
has a content of a compound, with a molecular weight of 200 or smaller, of more than 1% by mass and not more than 10% by mass of a total solid content.
2. The adhesion-promoting composition used between a curable composition for imprints and a substrate of claim 1 ,
wherein at least one kind of the compounds having a molecular weight of 500 or larger and having a reactive group is a novolac-type epoxy (meth)acrylate polymer.
3. The adhesion-promoting composition used between a curable composition for imprints and a substrate of claim 1 ,
wherein the compound having a molecular weight of 500 or larger and having a reactive group is a polymer being free from a cyclic structure in a side chain of the polymer.
4. The adhesion-promoting composition used between a curable composition for imprints and a substrate of claim 1 ,
wherein the compound having a molecular weight of 500 or larger and having a reactive group is a novolac-type epoxy (meth)acrylate polymer, and is a polymer being free from a cyclic structure in a side chain of the polymer.
5. The adhesion-promoting composition used between a curable composition for imprints and a substrate of claim 1 ,
wherein the compound having a molecular weight of 500 or larger and having a reactive group is a polymer, and;
the compound having a molecular weight of 200 or smaller is a monomer which composes the polymer, or a compound obtained by polymerizing two or more of the monomers.
6. The adhesion-promoting composition used between a curable composition for imprints and a substrate of claim 1 ,
wherein the compound having a molecular weight of 500 or larger and having a reactive group has a molecular weight of 3000 or larger.
7. The adhesion-promoting composition used between a curable composition for imprints and a substrate of claim 1 ,
wherein the compound having a molecular weight of 500 or larger and having a reactive group is mainly composed of a structural unit represented by the formula (A) below;
wherein R represents an alkyl group, each of L 1 and L 2 independently represents a divalent linking group, and P represents a polymerizable group; n represents an integer of 0 to 3.
8. The adhesion-promoting composition used between a curable composition for imprints and a substrate of claim 7 , wherein P represents a (meth)acryloyl group.
9. The adhesion-promoting composition used between a curable composition for imprints and a substrate of claim 1 , which comprises a solvent.
10. The adhesion-promoting composition used between a curable composition for imprints and a substrate of claim 1 , which comprises a solvent in an amount of 70% by mass or more of the composition.
11. The adhesion-promoting composition used between a curable composition for imprints and a substrate of claim 1 , which comprises a solvent and has 10% by mass or less, relative to a total ingredients, of ingredient other than the compound having a molecular weight of 500 or larger and having a reactive group, the compound having a molecular weight of 200 or smaller, and the solvent.
12. A cured article obtained by curing an adhesion-promoting composition for imprints and a substrate of claim 1 .
13. A pattern forming method comprising:
applying an adhesion-promoting composition used between a curable composition for imprints and a substrate of claim 1 , in the substrate to form an underlying layer; and,
applying the curable composition for imprints on a surface of the underlying layer.
14. The pattern forming method of claim 13 , further comprising: subsequently to applying the adhesion-promoting composition used between a curable composition for imprints and a substrate in the substrate, curing by heating or photo-irradiation a part of the adhesion-promoting composition used between a curable composition for imprints and a substrate; and applying the curable composition for imprints on a surface thereof.
15. The pattern forming method of claim 13 , further comprising:
subjecting the curable composition for imprints and the underlying layer, being held between the substrate and a finely-patterned mold, to photo-irradiation to thereby cure the curable composition for imprints; and removing the mold.
16. A method of manufacturing a semiconductor device comprising the pattern forming method of claim 13 .
17. A semiconductor device manufactured by the method of manufacturing a semiconductor device of claim 16 .