IP Library › Granted Patent US 9,289,754
Granted Patent B2
US 9,289,754 · App. 14/221,779 · Granted Mar 22, 2016

Honeycomb structure

Inventors: Yoshio Kikuchi (Nagoya, JP); Kenichi Hidaka (Nagoya, JP)
Assignee: NGK Insulators, Ltd.
B01J27/224C04B37/005C04B38/0019
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Quick Facts
Patent No.
US 9,289,754
App. No.
14/221,779
Granted
Mar 22, 2016
Kind
B2
Abstract

To provide a honeycomb structure capable of using as a catalyst carrier, which suitably functions as a heater by applying a voltage, and where a bonding layer is hard to break; and including a honeycomb segment bonded body where honeycomb segments are bonded by bonding layer, and a pair of electrode members disposed on side surface of the bonded body, wherein the electrode members is formed into a band shape, in a cross section perpendicular to the cell extending direction, the one electrode member is disposed on an opposite side across the center of the bonded body with respect to another electrode member, and in at least a part of the bonding layer, inorganic fibers made of an oxide are included in a porous body where particles of silicon carbide are bound with silicon in a state where pores are held among the particles.

Claims (25)

1. A honeycomb structure comprising:

a tubular honeycomb segment bonded body having a plurality of tubular honeycomb segments having porous partition walls defining a plurality of cells as through channels of a fluid which extend from a first end face as one end face to a second end face as another end face, and a bonding layer which bonds side surfaces of the plurality of tubular honeycomb segments to each other; and a pair of electrode members disposed on a side surface of the tubular honeycomb segment bonded body,

wherein volume resistivities of the tubular honeycomb segments of the tubular honeycomb segment bonded body are from 1 to 200 Ωcm,

at least a part of the bonding layer is made of a bonding material having a conductive property, a volume resistivity of the bonding layer is from 2 to 2000 Ωcm,

each of the pair of electrode members is formed into a band shape extending in an extending direction of the plurality of cells of the honeycomb segments, and in a cross section perpendicular to the extending direction of the plurality of cells, one electrode member in the pair of electrode members is disposed on an opposite side across the center of the tubular honeycomb segment bonded body with respect to another electrode member in the pair of electrode members, and

in at least a part of the bonding layer, inorganic fibers made of an oxide are included in a porous body where particles of silicon carbide as an aggregate are bound with silicon as a binding material in a state where pores are held among the particles.

2. The honeycomb structure according to claim 1 , wherein the inorganic fibers are Al 2 O 3 -containing fibers.

3. The honeycomb structure according to claim 2 , wherein a mass ratio of Al 2 O 3 in the inorganic fibers is 70 mass % or more.

4. The honeycomb structure according to claim 1 , wherein a liquid phase formation temperature of the inorganic fibers is 1800° C. or more.

5. The honeycomb structure according to claim 1 , wherein an average fiber length of the inorganic fibers is 100 μm or more.

6. The honeycomb structure according to claim 1 , wherein an average fiber diameter of the inorganic fibers is from 2 to 30 μm.

7. The honeycomb structure according to claim 1 ,

wherein in a region of the bonding layer where the inorganic fibers are included, a volume ratio of the inorganic fibers to a total volume of the silicon, the silicon carbide and the inorganic fibers included in the bonding layer is from 10 to 20 vol %.

8. The honeycomb structure according to claim 1 ,

wherein a volume ratio of the silicon to a total volume of the silicon, the silicon carbide and the inorganic fibers included in the bonding layer is from 30 to 60 vol %.

9. The honeycomb structure according to claim 1 ,

wherein a volume ratio of the silicon carbide to the total volume of the silicon, the silicon carbide and the inorganic fibers included in the bonding layer is from 30 to 60 vol %.

10. The honeycomb structure according to claim 1 ,

wherein an average particle diameter of the particles of the silicon carbide included in the bonding layer is from 10 to 60 μm.

11. The honeycomb structure according to claim 1 ,

wherein the bonding layer further comprises an oxide consisted of an alkaline earth metal oxide, Al 2 O 3 and SiO 2 .

12. The honeycomb structure according to claim 11 , wherein the alkaline earth metal oxide is MgO.

13. The honeycomb structure according to claim 11 ,

wherein the oxide of 1 to 10 parts by volume are comprised when the total volume of the silicon, the silicon carbide and the inorganic fibers included in the bonding layer is 100 parts by volume.

14. The honeycomb structure according to claim 1 , wherein a porosity of the bonding layer is from 60 to 80%.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 21, 2014
From: KIKUCHI, YOSHIO; HIDAKA, KENICHI
To: NGK INSULATORS, LTD.
Reel/Frame 032497/0773 →
Priority Claims (1)
JP 2013-075211 · Mar 29, 2013 · national
Continuity (1)
Related Publication 20140296054A1 · Oct 2, 2014