Array substrate and manufacturing method thereof, and display panel

1. An array substrate, comprising a base, and the base comprising a display region for displaying and a periphery region outside the display region, a plurality of lead wires extending from the display region to the periphery region being provided on a first side of the base, wherein,

a plurality of conductive via-holes are provided in the periphery region of the base, the conductive via-holes are electrically connected with the respective lead wires and provided with conductive material therein, the lead wires are electrically connected to a second side of the base through the respective conductive via-holes;

a back-side structure electrically connected with the conductive via-holes is provided on the second side of the base, and the back-side structure comprises a plurality of lead wire pads electrically connected with the respective conductive via holes; and wherein

the back-side structure further comprises a plurality of back-side lead wires respectively connected between the conductive via-holes and the lead wire pads.

2. The array substrate of claim 1 , wherein,

each of the conductive via-holes has a diameter between 5 μm to 100 μm, and

a center-to-center pitch between adjacent conductive via-holes is between 10 μm and 80 μm.

3. The array substrate of claim 1 , wherein,

the conductive material is any one of copper, silver and chrome, or alloy thereof.

4. The array substrate of claim 1 , wherein,

the back-side structure further comprises a driver IC connected with the lead wire pads.

5. The array substrate of claim 1 , wherein,

the array substrate is a liquid crystal display array substrate or a bottom emission type organic light emitting diode display array substrate,

the back-side structure is provided in the periphery region.

6. The array substrate of claim 1 , wherein,

the array substrate is a top emission type organic light emitting diode display array substrate,

the back-side structure is at least partially provided in the display region.

7. The array substrate of claim 1 , wherein,

the lead wires comprise gate lines and/or data lines.

8. A display panel, comprising the array substrate of claim 1 .

9. The display panel of claim 8 , further comprising:

a substrate for aligning with the array substrate to form a cell, wherein edges of the substrate for aligning with the array substrate to form a cell and edges of the array substrate are aligned with each other.

10. The display panel of claim 9 , wherein,

the substrate for aligning with the array substrate to form a cell is a color filter substrate or a package substrate.

11. A manufacturing method of an array substrate, the array substrate comprising a base, and the base comprising a display region for displaying and a periphery region outside the display region, a plurality of lead wires extending from the display region to the periphery region being provided on a first side of the base, the manufacturing method comprising:

step S 11 of forming a plurality of via-holes in the periphery region of the base;

step S 12 of forming conductive material in each of the via-holes to form conductive via-holes, wherein,

the conductive via-holes are electrically connected with the respective lead wires, and the lead wires are electrically connected to a second side of the base through the respective conductive via-holes,

a back-side structure electrically connected with the conductive via-holes is provided on the second side of the base, and the back-side structure comprises a plurality of lead wire pads electrically connected with the respective conductive via-holes.

12. The manufacturing method of claim 11 , wherein, the step S 11 comprises:

forming a plurality of via-holes in the periphery region of the base by a laser drilling process.

13. The manufacturing method of claim 11 , wherein, the step S 12 comprises:

step S 121 of vapor depositing conductive material on a side of the base to form a conductive material layer;

step S 122 of vapor depositing conductive material on another side of the base to form a conductive material layer while depositing conductive material in the via-holes;

step S 123 of forming a plurality of conductive patterns electrically connected with the respective conductive via-holes on the first side of the base by using the conductive material layer thereon through a patterning process, and forming a plurality of conductive patterns electrically connected with the respective conductive via-holes on the second side of the base by using the conductive material layer thereon through a patterning process.

14. The manufacturing method of claim 13 , wherein,

in the step S 123 , the conductive patterns formed on the second side of the base comprise lead wire pads.

15. The manufacturing method of claim 13 , wherein, after the step S 122 , the step S 12 further comprises:

thickening the conductive material layers by an electroplating process.

16. The manufacturing method of claim 11 , further comprising:

forming a display structure comprising lead wires on the first side of the base by a patterning process after the step S 12 , wherein,

the lead wires are electrically connected with the conductive via-holes.

17. The manufacturing method of claim 11 , further comprising:

forming a display structure comprising lead wires on the first side of the base by a patterning process before the step S 11 , wherein,

the lead wires are electrically connected with the conductive via-holes.