Camera module
The present invention relates to a camera module, the module including: a PCB; an image sensor mounted on the PCB and formed with an image pickup device; a base mounted on the PCB and including a plated portion formed at a lower center with an opening mounted with an IR filter; a lower spring plate formed with a conductive material; a spacer arranged on an upper surface of the lower spring plate and forming a staircase structure by a rib wrapping a periphery of the lower spring plate to supportively apply a pressure to the lower spring plate; a lens actuator including a bobbin, and a yoke; an upper spring plate coupled to an upper surface of the lens actuator; and a cover attached to an upper surface of the upper spring plate.
1. A camera module, the camera module comprising:
an image sensor;
a PCB (printed circuit board) mounted with the image sensor;
a base disposed at an upper side of the PCB;
an actuator including a bobbin disposed over the base and a coil disposed on the bobbin,
wherein the bobbin is configured to move in a vertical direction;
an upper spring and a lower spring configured to support the bobbin;
a lens assembly coupled to the bobbin;
a shield can covering the actuator, the upper spring, and the lower spring; and
a protrusion protruded on the base and disposed between the lower spring and the shield can in a horizontal direction perpendicular to the vertical direction, wherein the lower spring is spaced apart from the shield can and the protrusion is disposed within the shield can;
wherein the lower spring includes two springs spaced apart from each other;
wherein the two springs are coupled to an upper surface of the base and is electrically connected to the PCB;
wherein the shield can, the protrusion, and the lower spring are overlapped in the horizontal direction;
and
wherein the shield can extends lower than a lower surface of the lower spring in the vertical direction and is connected to the PCB by an adhesive.
2. The camera module of claim 1 , wherein the adhesive is a conductive epoxy.
3. The camera module of claim 1 , wherein the actuator further includes a yoke.
4. The camera module of claim 1 , further comprising a cover disposed on the actuator.
5. The camera module of claim 1 , wherein the base comprises a square-shaped opening at a center thereof, and wherein a filter is coupled to a lower surface of the base around the opening.
6. The camera module of claim 1 , wherein a height of the protrusion corresponds to a thickness of the lower spring.
7. The camera module of claim 1 , wherein the shortest distance between a lateral surface of a periphery of the lower spring and an inner lateral surface of the shield can, in the horizontal direction perpendicular to the vertical direction, is longer than the shortest distance between a lateral surface of the base and the inner lateral surface of the shield can in the horizontal direction.
8. A camera module, the camera module comprising:
an image sensor;
a PCB (printed circuit board) mounted with the image sensor;
a base;
an actuator including a bobbin disposed over the base and a coil disposed on the bobbin, wherein the bobbin is configured to move in a vertical direction;
an upper spring and a lower spring configured to support the bobbin;
a lens assembly coupled to the bobbin;
a shield can covering the actuator, the upper spring, and the lower spring; and
a protrusion protruded on the base and disposed between the lower spring and the shield can in a horizontal direction perpendicular to the vertical direction, wherein the lower spring is spaced apart from the shield can and the protrusion is disposed within the shield can;
wherein the lower spring includes two springs spaced apart from each other;
wherein the two springs are disposed on an upper surface of the base and electrically connected to the coil;
wherein the shield can, the protrusion, and the lower spring are overlapped in a horizontal direction; and
wherein the shield can is connected to the PCB by a conductive adhesive.
9. The camera module of claim 8 , wherein the protrusion is integrally formed with the base.
10. The camera module of claim 8 , wherein an upper surface of the protrusion is formed higher than an upper surface of the lower spring.
11. The camera module of claim 8 , wherein the lower spring and the shield can are electrically insulated from each other.
12. The camera module of claim 8 , wherein the base further includes a plate portion formed inside the protrusion and having the lower spring disposed thereon.
13. The camera module of claim 8 , wherein the protrusion is formed at an upper surface of the base at a height higher than a thickness of the lower spring.
14. The camera module of claim 8 , wherein the protrusion of the base wraps around a perimeter of the lower spring.
15. The camera module of claim 8 , further comprising a cover disposed on the actuator.
16. The camera module of claim 8 , wherein the base comprises a square-shaped opening at a center thereof, and wherein a filter is coupled to a lower surface of the base around the opening.
17. The camera module of claim 8 , wherein the lower spring is a conductor configured to supply electric power to the actuator.
18. The camera module of claim 8 , wherein the lower spring is spaced apart from an edge of the base at a predetermined distance when viewed from a top, such that the lower spring is spaced apart from the edge of the base in the horizontal direction.
19. The camera module of claim 8 , wherein the lower spring is formed with a terminal to be electrically connected to a circuit of the PCB.
20. The camera module of claim 19 , wherein the terminal is connected to the PCB after protruding into the base.
21. The camera module of claim 20 , wherein the terminal is not protruded from an edge of the camera module when viewed from a top, such that the terminal is not protruded from the edge of the camera module in the horizontal direction.
22. An electronic element comprising the camera module recited in claim 8 .
23. The camera module according to claim 8 , wherein the shield can extends lower than a lower surface of the lower spring in the vertical direction.