IP Library › Granted Patent US 9,303,861
Granted Patent B2
US 9,303,861 · App. 12/975,445 · Granted Apr 5, 2016

Light emitting diode light source modules

Inventors: Qing (Charles) Li (Las Vegas, NV); Yangcheng Huang (Guangdong, CN); Haijun Wang (Guangdong, CN); Guowen Lei (Guangdong, CN); Cuie Wei (Guangdong, CN); Menghua Long (Guangdong, CN); GuiLin Wang (Guangdong, CN)
Assignee: US VAOPTO, Inc.
F21V31/04F21S4/001F21Y2101/02
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Quick Facts
Patent No.
US 9,303,861
App. No.
12/975,445
Granted
Apr 5, 2016
Kind
B2
Abstract

The present invention provides a highly-protective, heat dissipating LED light source module that may be waterproof or non-waterproof. In an embodiment, the present invention provides an LED light source module comprising: a waterproof housing comprising a metal substrate and a plastic cover integrally disposed on one or more surfaces of the metal substrate; and at least one light emitting diode, electronic component, and power line disposed on and operably connected with the metal substrate and encapsulated thereon by the plastic cover. In other embodiments are provided LED light source modules comprising: a circuit board with at least two through holes disposed at selected positions; at least one light emitting diode, electronic component, and power line disposed on the circuit board and operably connected therewith; and a plastic cover comprising at least two pins disposed and shaped for interconnection with corresponding through holes of the circuit board. The simple LED light source models disclosed may be efficiently and inexpensively produced and are capable of withstanding the harsh environments in which they are sometimes used.

Claims (30)

1. An LED light source module comprising:

a waterproof housing comprising a metal substrate and a plastic cover integrally disposed on one or more surfaces of the metal substrate; and

at least one light emitting diode (LED), electronic component, and power line disposed on and operably connected with the metal substrate and encapsulated thereon by the plastic cover;

wherein the plastic cover comprises a through hole disposed above each light emitting diode to permit light to escape the LED module and the plastic cover is in direct contact with each light emitting diode;

and wherein the plastic cover and the metal substrate each comprise a through hole which cooperate together to provide a fixing hole for fixation of the waterproof housing to a support, which fixing hole passes entirely through the module.

2. The LED light source module of claim 1 , wherein the housing is integrally disposed on the metal substrate by injection molding.

3. The LED light source module of claim 2 , wherein one or more reflector cup is provided by the plastic cover.

4. The light source module of claim 3 , wherein one or more of the reflector cups has four slanted faces.

5. The LED light source module of claim 2 , wherein the plastic cover is integrally disposed on the metal substrate in a manner that provides a partially encapsulated substrate.

6. The LED light source module of claim 5 , wherein the metal substrate is an elongated member and the plastic cover encapsulates all but one exposed surface of the substrate which exposed surface is capable of operating as a heat sink for the module.

7. The LED light source module of claim 6 , wherein the surface of the substrate not encapsulated by the plastic cover comprises radiating fins or ribs.

8. The LED light source module of claim 5 , wherein the metal substrate is an elongated member and the plastic cover encapsulates more than 50% of the substrate surfaces.

9. The LED light source module of claim 2 , wherein the light emitting diode is a surface mountable (SMD-type) light emitting diode.

10. The LED light source module of claim 2 , wherein the light emitting diode(s) are white LED or full-color LED.

11. An LED light source module system comprising, in parallel connection with one another, a plurality of light source modules of claim 1 .

12. The LED light source module of claim 1 , wherein a periphery of the plastic cover encircles the metal substrate.

13. The LED light source module of claim 12 , wherein the plastic cover is integrally disposed on the metal substrate in a manner that provides a partially encapsulated substrate.

14. An LED light source module comprising:

a circuit board with at least two through holes disposed at selected positions;

at least one light emitting diode, electronic component, and power line disposed on the circuit board and operably connected therewith; and

a plastic cover in direct contact with each light emitting diode, and comprising at least one hole to permit light to escape the LED module, and comprising at least two pins disposed and shaped for interconnection with corresponding through holes of the circuit board;

wherein the pins are integrally formed in the plastic cover;

wherein at least one of the pins of the plastic cover is a hollow pin with a through hole;

and the plastic cover is disposed on the circuit board such that the through hole of the hollow pin of the plastic cover and a through hole of the circuit board align to provide a fixing hole passing entirely through the light source module for fixing the light source module to a support surface.

15. The LED light source module of claim 14 , wherein the plastic cover comprises at least three pins and the circuit board comprises at least three through holes, wherein the pins of the plastic cover are configured to provide for a fixed connection between the plastic cover and circuit board.

16. The LED light source module of claim 15 , wherein at least a portion of the pins are wider than the corresponding through holes to provide a fixed, interference fit between the pins and the through holes.

17. The LED light source module of claim 16 , wherein a periphery of the plastic cover encircles the metal substrate.

18. The LED light source module of claim 14 , wherein one or more reflector cup is provided by the plastic cover.

19. An LED light source module system comprising, in parallel connection with one another, a plurality of light source modules of claim 14 .

20. The light source module of claim 14 comprising two fixing holes.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 8, 2015
From: VIRGINIA OPTOELECTRONICS, INC.; LI, QING CHARLES; VAOPTO, LLC
To: US VAOPTO, INC.
Reel/Frame 036027/0989 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 6, 2013
From: HUANG, YANGCHENG; WANG, HAIJUN; LEI, GUOWEN; WEI, CUIE; LONG, MENGHUA; WANG, GUILIN
To: FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD
Reel/Frame 029934/0755 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 10, 2012
From: LI, QING (CHARLES)
To: VIRGINIA OPTOELECTRONICS, INC.
Reel/Frame 027505/0620 →
Priority Claims (2)
CN 201020528196.9 · Sep 14, 2009 · national
CN 200920264978.3 · Dec 22, 2009 · national
Continuity (1)
Related Publication 20120002407A1 · Jan 5, 2012