IP Library › Granted Patent US 9,305,984
Granted Patent B2
US 9,305,984 · App. 14/461,657 · Granted Apr 5, 2016

Flexible display and manufacturing method thereof

Inventor: Jin Gyu Kang (Yongin, KR)
Assignee: Samsung Display Co., Ltd.
H01L27/3251H01L27/1259H01L27/3244H01L27/3248H01L51/0097H01L51/5253H01L2227/323H01L2251/5338H01L2251/558
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Quick Facts
Patent No.
US 9,305,984
App. No.
14/461,657
Granted
Apr 5, 2016
Kind
B2
Abstract

A method of manufacturing a flexible display includes: forming a first barrier layer on a flexible substrate; forming a second barrier layer including silicon nitride on the first barrier layer; releasing stress of the second barrier layer; forming a first buffer layer including silicon nitride on the second barrier layer; forming a second buffer layer on the first buffer layer; and forming a thin film transistor on the second buffer layer.

Claims (23)

1. A method of manufacturing a flexible display, comprising:

forming a first barrier layer on a flexible substrate;

forming a second barrier layer comprising silicon nitride on the first barrier layer;

exposing the second barrier layer to the air in order to release stress of the second barrier layer and form an oxide film on the second barrier layer;

forming a first buffer layer comprising silicon nitride having the same film quality as the second barrier layer on the second barrier layer;

forming a second buffer layer on the first buffer layer; and

forming a thin film transistor on the second buffer layer.

2. The method of claim 1 , wherein

the flexible substrate comprises at least one polymer material layer comprising polyimide.

3. The method of claim 2 , wherein the flexible substrate includes:

a first flexible substrate;

an intermediate barrier layer formed on the first flexible substrate; and

a second flexible substrate formed on the intermediate barrier layer,

wherein the intermediate barrier layer comprises a same material as the first barrier layer.

4. The method of claim 3 , further comprising:

forming an adhesive layer between the first flexible substrate and the second flexible substrate,

wherein the adhesive layer comprises at least one of amorphous silicon on which a P-type or N-type conductive impurity is doped, or hydrogenated amorphous silicon.

5. The method of claim 3 , wherein

the intermediate barrier layer is formed to have a thickness of about 1000 Å to about 6000 Å.

6. The method of claim 3 , wherein

the first flexible substrate and the second flexible substrate comprise polyimide.

7. The method of claim 3 , wherein

each of the first flexible substrate and the second flexible substrate is formed to have a thickness of about 8 μm to about 12 μm.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 18, 2014
From: KANG, JIN GYU
To: SAMSUNG DISPLAY CO., LTD.
Reel/Frame 033553/0849 →
Priority Claims (1)
KR 10-2013-0134331 · Nov 6, 2013 · national
Continuity (1)
Related Publication 20150123098A1 · May 7, 2015