Trench MOSFET having reduced gate charge
A trench MOSFET device includes a semiconductor layer of a first doping type. MOS transistor cells are in a body region of a second doping type in the semiconductor layer. The transistor cells include a first cell type including a first trench providing a first gate electrode or the first gate electrode is on the semiconductor surface between the first trench and a second trench, and a first source region is formed in the body region. The first gate electrode is electrically isolated from the first source region. A second cell type has a third trench providing a second gate electrode or the second gate electrode is on the semiconductor surface between the third trench and a fourth trench, and a second source region is in the body region. An electrically conductive member directly connects the second gate electrode, first source region and second source region together.
1. A trench metal-oxide-semiconductor field-effect transistor (MOSFET) device, comprising:
a semiconductor layer of a first doping type to form a drain region;
a body region of a second doping type positioned above the drain region;
a source region of the first doping type positioned above the body region;
an active transistor cell including:
a first gate electrode positioned in a first trench extending through the source region and the body region; and
a dielectric liner positioned in the first trench and isolating the first gate electrode from the source region; and
a diode-connected transistor cell adjacent to the active transistor cell, the diode-connected transistor cell including:
a second gate electrode positioned in a second trench extending through the source region and the body region; and
a conductor coupling the second gate electrode with the source region adjacent to the second gate electrode to establish a diode structure.
2. The trench MOSFET device of claim 1 , further comprising:
an epitaxial layer positioned above the semiconductor layer, the epitaxial layer defining a drain drift region under the body region.
3. The trench MOSFET device of claim 1 , wherein the first doping type is n-type, and the active transistor cell includes n-channel between the drain region and the source region.
4. The trench MOSFET device of claim 1 , wherein the first doping type is p-type and the active transistor cell includes a p-channel between the drain region and the source region.
5. The trench MOSFET device of claim 1 , wherein the first gate electrode and the second gate electrode both comprise polysilicon.
6. The trench MOSFET device of claim 1 , wherein the active transistor cell includes N first gate electrodes positioned in N first trenches, each extending through the source region and the body region, the diode-connected transistor cell includes M second gate electrodes positioned in M first trenches, each extending through the source region and the body region such that a ratio of N over M ranges from 3:1 to 10:1.
7. The trench MOSFET device of claim 1 , wherein the conductor includes a metal filled trench extending into the second gate electrode and connecting to a source metal layer above the source region.
8. The trench gate MOSFET device of claim 1 , further comprising:
a source contact hole positioned between the first gate electrode and the second gate electrode, the source contact hole extending into the source region;
wherein the conductor couples the second gate electrode with the source region via the source contact hole.