Packaged microphone with frame having die mounting concavity
A packaged microphone has a lid structure with an inner surface having a concavity, and a microphone die secured within the concavity. The packaged microphone also has a substrate coupled with the lid structure to form a package having an interior volume containing the microphone die. The substrate is electrically connected with the microphone die. In addition, the packaged microphone also has aperture formed through the package, and a seal proximate to the microphone die. The seal acoustically seals the microphone and the aperture to form a front volume and a back volume within the interior volume. The aperture is in acoustic communication with the front volume.
1. A packaged microphone comprising:
a molded cover including an inner cover surface;
a molded frame secured to the cover to form a lid structure, the frame having a frame surface with a concavity;
a microphone die secured within the concavity of the frame;
a substrate including an inner substrate surface and coupled with the lid structure and being electrically connected with the microphone die, the substrate and lid structure forming a package having an interior volume containing the microphone die within the concavity;
at least one of a bump and ball electrically connecting the substrate with the microphone die;
an aperture through the package; and
a seal proximate to the microphone die, the seal acoustically sealing the microphone and the aperture to form a front volume and a back volume within the interior volume,
wherein the inner cover surface is generally parallel with the inner substrate surface, the frame surface being between the inner cover surface and the inner substrate surface, the frame surface and inner cover surface forming at least a portion of the back volume.
2. The packaged microphone as defined by claim 1 wherein the frame and cover are plastic injection molded components.
3. The packaged microphone as defined by claim 1 wherein the substrate comprises a printed circuit board.
4. The packaged microphone as defined by claim 1 wherein the microphone die comprises a variable capacitor formed from a diaphragm and a backplate, the microphone die being mounted with the diaphragm a first distance from the aperture, the microphone die being mounted with the backplate being mounted a second distance from the aperture, the first distance being less than the second distance.
5. The packaged microphone as defined by claim 1 wherein the frame comprises a circuit concavity and a circuit die secured within the circuit concavity.
6. The packaged microphone as defined by claim 1 wherein the seal is between the microphone and the substrate.
7. The packaged microphone as defined by claim 1 wherein the seal is between the substrate and the lid structure.
8. The packaged microphone as defined by claim 1 further comprising a second die in the concavity.
9. A packaged microphone comprising:
a molded cover;
a molded frame secured to the cover to form a lid structure, the frame having a frame surface with a concavity;
a microphone die secured within the concavity of the frame and comprising a variable capacitor formed from a diaphragm and a backplate;
a substrate coupled with the lid structure and being electrically connected with the microphone die, the substrate and lid structure forming a package having an interior volume containing the microphone die within the concavity;
at least one of a bump and ball electrically connecting the substrate with the microphone die;
an aperture through the package; and
a seal proximate to the microphone die, the seal acoustically sealing the microphone and the aperture to form a front volume and a back volume within the interior volume,
wherein the microphone die is mounted with the diaphragm a first distance from the aperture, the microphone die being mounted with the backplate being mounted a second distance from the aperture, the first distance being less than the second distance.
10. The packaged microphone as defined by claim 9 wherein the substrate includes an inner substrate surface, the cover includes an inner cover surface, the inner cover surface being generally parallel with the inner substrate surface, the frame surface being between the inner cover surface and the inner substrate surface, the frame surface and inner cover surface forming at least a portion of the back volume.
11. The packaged microphone as defined by claim 9 wherein the frame and cover are plastic injection molded components.
12. The packaged microphone as defined by claim 9 wherein the substrate comprises a printed circuit board.
13. The packaged microphone as defined by claim 9 wherein the frame comprises a circuit concavity and a circuit die secured within the circuit concavity.
14. The packaged microphone as defined by claim 9 wherein the seal is between the microphone and the substrate.
15. The packaged microphone as defined by claim 9 wherein the seal is between the substrate and the lid structure.
16. The packaged microphone as defined by claim 9 further comprising a second die in the concavity.