Semiconductor devices
A semiconductor device includes a first doping region extending from a main surface of a semiconductor substrate into the semiconductor substrate. Further, the semiconductor device includes a second doping region arranged adjacent to the first doping region. The first doping region includes at least one low doping dose portion extending from the main surface of the semiconductor substrate to the second doping region. A doping dose within the low doping dose portion of the first doping region is less than 3 times a breakdown charge. Additionally, the semiconductor device includes a first electrode structure in contact with the first doping region at the main surface of the semiconductor substrate. The work function of the first electrode structure at the main surface of the semiconductor substrate is larger than 4.9 eV or lower than 4.4 eV.
1. A semiconductor device, comprising:
a first doping region extending from a main surface of a semiconductor substrate into the semiconductor substrate, wherein the first doping region comprises a first conductivity type;
a second doping region arranged adjacent to the first doping region, wherein the second doping region comprises a second conductivity type, wherein the first doping region comprises at least one low doping dose portion extending from the main surface of the semiconductor substrate to the second doping region, wherein a doping dose within the low doping dose portion of the first doping region is less than 3 times a breakdown charge;
a first electrode structure in contact with the first doping region at the main surface of the semiconductor substrate, wherein the work function of the first electrode structure at the main surface of the semiconductor substrate is larger than 4.9 eV or lower than 4.4 eV; and
a second electrode structure in contact with the second doping region.
2. The semiconductor device according to claim 1 , wherein a Schottky barrier between the first electrode structure and the first doping region is lower than 0.3 eV for majority charge carriers of the first doping region.
3. The semiconductor device according to claim 1 , wherein the first electrode structure comprises platinum silicide or iridium silicide.
4. The semiconductor device according to claim 1 , wherein a charge carrier life time within at least a part of the second doping region is longer than 10 μs.
5. The semiconductor device according to claim 1 , wherein a doping dose within the low doping dose portion of the first doping region is less than 1 time a breakdown charge.
6. The semiconductor device according to claim 1 , wherein the first doping region and the second doping region implement a bipolar diode between the first electrode structure and the second electrode structure.
7. The semiconductor device according to claim 1 , wherein the second electrode structure is in contact with the second doping region at a back side of the semiconductor substrate, wherein the back side of the semiconductor substrate is located opposite to the main surface of the semiconductor substrate.
8. The semiconductor device according to claim 1 , wherein the second doping region comprises a drift region and an emitter region, wherein the emitter region is in contact with the second electrode structure at a back side of the semiconductor substrate, wherein the emitter region comprises a higher average doping concentration than the drift region.
9. The semiconductor device according to claim 1 , wherein the first doping region extends into a depth of less than 4 μm into the semiconductor substrate.
10. The semiconductor device according to claim 1 , comprising an insulation trench adjacent to at least a part of the first doping region.
11. The semiconductor device according to claim 10 , wherein the insulation trench comprises a trench electrode insulated from the semiconductor substrate by an insulating layer within the insulation trench, wherein the trench electrode is short cut with the first electrode structure.
12. The semiconductor device according to claim 10 , wherein the insulation trench extends deeper into the semiconductor substrate than the first doping region.
13. The semiconductor device according to claim 10 , comprising a floating doping region comprising the first conductivity type, wherein the floating doping region is located adjacent to the insulation trench opposite to the first doping region.
14. The semiconductor device according to claim 1 , wherein the first doping region is an anode/cathode region of a diode and the second doping region is the cathode/anode region of the diode.
15. A semiconductor device, comprising:
a first doping region extending from a main surface of a semiconductor substrate into the semiconductor substrate, wherein the first doping region comprises a first conductivity type;
a second doping region arranged adjacent to the first doping region, wherein the second doping region comprises a second conductivity type, wherein the first doping region comprises at least one low doping dose portion extending from the main surface of the semiconductor substrate to the second doping region, wherein a doping dose within the low doping dose portion of the first doping region is less than 3 times a breakdown charge;
a first electrode structure in contact with the first doping region at the main surface of the semiconductor substrate;
an insulation trench adjacent to at least a part of the first doping region; and
a second electrode structure in contact with the second doping region.
16. The semiconductor device according to claim 15 , wherein the first doping region is an anode/cathode region of a diode and the second doping region is the cathode/anode region of the diode.