Monolithic ceramic electronic component
A monolithic ceramic electronic component includes an outer electrode including a first plating layer formed directly on a component body by electroless plating so as to cover an exposed portion distribution region including exposed portions of a plurality of inner electrodes and a second plating layer formed by electrolytic plating so as to cover the first plating layer. An amount of extension of the first plating E 1 and an amount of extension of the second plating E 2 satisfy the relationship E 1 /(E 1 +E 2 )≦20%, where E 1 represents a distance from an edge of the exposed portion distribution region to an edge of the first plating layer, and E 2 represents a distance from the edge of the first plating layer to an edge of the second plating layer.
1. A monolithic ceramic electronic component comprising:
a component body including a plurality of stacked ceramic layers and a plurality of electrode layers arranged along the ceramic layers, the electrode layers each including an exposed portion exposed at a particular surface; and
an outer electrode disposed on the particular surface of the component body so as to be electrically connected to the exposed portions of the electrode layers; wherein
the exposed portions of the electrode layers define an exposed portion distribution region on the particular surface;
the outer electrode includes:
a first plating layer that is an electrolessly plated layer disposed directly on the particular surface so as to cover the exposed portion distribution region; and
a second plating layer that is an electrolytically plated layer that covers the first plating layer; and
a following relationship is satisfied:
(amount of extension of first plating)/{(amount of extension of first plating)+(amount of extension of second plating)}≦20%,
where the amount of extension of first plating represents a distance from an edge of the exposed portion distribution region to an edge of the first plating layer, and the amount of extension of second plating represents a distance from the edge of the first plating layer to an edge of the second plating layer.
2. The monolithic ceramic electronic component according to claim 1 , wherein the electrode layers include an inner electrode arranged along an interface between the ceramic layers, and a surface electrode arranged along the ceramic layers and on an outer surface of the component body.
3. The monolithic ceramic electronic component according to claim 1 , wherein
the first plating layer includes a Ni—P plating layer; and
a phosphorus content of the first plating layer is about 9% by weight to about 13% by weight.
4. The monolithic ceramic electronic component according to claim 1 , wherein the second plating layer includes a plurality of plating films.
5. The monolithic ceramic electronic component according to claim 1 , wherein
the first plating layer includes a Ni—P plating layer; and
a phosphorus content of the first plating layer is about 2% by weight to about 18% by weight.
6. The monolithic ceramic electronic component according to claim 1 , wherein the amount of extension of the first plating is less than a thickness of the first plating layer.
7. The monolithic ceramic electronic component according to claim 1 , wherein the amount of extension of the second plating is greater than a thickness of the second plating layer.
8. The monolithic ceramic electronic component according to claim 1 , wherein the first plating layer includes a Ni—P plating layer that is amorphous.
9. The monolithic ceramic electronic component according to claim 1 , further comprising auxiliary electrodes disposed at interfaces between the ceramic layers and auxiliary electrodes disposed on outer surfaces of the component body.
10. The monolithic ceramic electronic component according to claim 9 , wherein the component body includes a plurality of first inner electrodes and a plurality of second inner electrodes alternately arranged in a stacking direction, and the plurality of auxiliary electrodes are arranged on both end portions of the component body in the stacking direction.
11. The monolithic ceramic electronic component according to claim 10 , wherein the auxiliary electrodes are further arranged on a first main surface and a second main surface of the component body.
12. The monolithic ceramic electronic component according to claim 9 , wherein four of the auxiliary electrodes are provided.
13. The monolithic ceramic electronic component according to claim 9 , wherein eight of the auxiliary electrodes are provided.
14. The monolithic ceramic electronic component according to claim 1 , wherein the monolithic ceramic electronic component is one of a two-terminal monolithic ceramic capacitor, a three-terminal monolithic ceramic capacitor, and an eight-terminal monolithic ceramic capacitor.
15. The monolithic ceramic electronic component according to claim 1 , wherein the monolithic ceramic electronic component is one of a monolithic ceramic capacitor, an inductor, a thermistor, and a piezoelectric component.
16. The monolithic ceramic electronic component according to claim 1 , wherein the ceramic layers are made of one of a dielectric ceramic, a magnetic ceramic, a semiconductor ceramic, and a piezoelectric ceramic.