Semiconductor device
A semiconductor device ( 100 a ) with a thin-film transistor ( 10 a ) includes: a gate electrode ( 62 ) formed on a substrate ( 60 ); a gate insulating layer ( 66 ) formed on the gate electrode; an oxide semiconductor layer ( 68 ) formed on the gate insulating layer; source and drain electrodes ( 70 s , 70 d ) electrically connected to the oxide semiconductor layer; a protective layer ( 72 ) formed on the oxide semiconductor layer and the source and drain electrodes; an oxygen supplying layer ( 74 ) formed on the protective layer; an anti-diffusion layer ( 78 ) formed on the oxygen supplying layer; and a transparent electrode ( 81 ) formed on the anti-diffusion layer and made of an amorphous transparent oxide.
1. A semiconductor device including a thin-film transistor, the device comprising:
a gate electrode formed on a substrate;
a gate insulating layer formed on the gate electrode;
an oxide semiconductor layer formed on the gate insulating layer;
source and drain electrodes electrically connected to the oxide semiconductor layer;
a protective layer formed on the oxide semiconductor layer and the source and drain electrodes;
an oxygen supplying layer formed on the protective layer;
an anti-diffusion layer formed on the oxygen supplying layer; and
a transparent electrode formed on the anti-diffusion layer, the transparent electrode being made of an amorphous transparent oxide; wherein
the anti-diffusion layer is another transparent electrode which is made of a crystalline transparent oxide.
2. The semiconductor device of claim 1 , wherein the anti-diffusion layer is formed so as to cover the thin-film transistor with the protective layer and the oxygen supplying layer interposed between them.
3. The semiconductor device of claim 1 , wherein the oxygen supplying layer is made of a material including water (H 2 O), an OR group, or an OH group.
4. The semiconductor device of claim 1 , wherein the oxygen supplying layer is made of an acrylic resin, an SOG material, a silicone resin, an ester-polymerization resin, or a resin including a silanol group, a CO—OR group or an Si—OH group.
5. The semiconductor device of claim 1 , wherein the oxygen supplying layer has a thickness falling within the range of 500 nm to 3500 nm.
6. The semiconductor device of claim 1 , wherein the anti-diffusion layer has a thickness falling within the range of 50 nm to 500 nm.
7. The semiconductor device of claim 1 , wherein the protective layer is made of silicon oxide or silicon nitride.
8. The semiconductor device of claim 1 , wherein an etch stopper layer is formed so as to cover the channel region of the oxide semiconductor layer.
9. The semiconductor device of claim 1 , wherein the source and drain electrodes are formed under the oxide semiconductor layer.
10. A liquid crystal display device including the semiconductor device of claim 1 , wherein the transparent electrode is a pixel electrode, and that another transparent electrode is a common electrode.
11. The semiconductor device of claim 1 , wherein the oxide semiconductor layer includes an In—Ga—Zn—O based semiconductor.