Composite member including substrate made of composite material
A composite member has a substrate made of a composite material having SiC combined with magnesium or a magnesium alloy, and has a warpage degree of not less than 0.01×10 −3 and not more than 10×10 −3 , the warpage degree being defined as lmax/Dmax, where lmax being a difference between a maximum value and a minimum value of surface displacement of one surface of composite member measured along a longest side thereof, and Dmax being a length of the longest side. Thereby, a composite member capable of efficiently dissipating heat to an installation object, a heat-dissipating member using the composite member, and a semiconductor device having the heat-dissipating member are provided.
1. A composite member, comprising
a substrate made of a composite material having SiC combined with pure magnesium containing not less than 99.8% by mass of Mg and an impurity, or a magnesium alloy composed of an additive element and the remainder containing Mg and an impurity, the total content of the additive element is not more than 20% by mass when the entire alloy is set as 100% by mass,
the composite member satisfying a warpage degree of not less than 0.01×10 −3 and not more than 2.0×10 −3 , said warpage degree being defined as a ratio of Imax to Dmax (Imax/Dmax), where Imax being a difference between a maximum value and a minimum value of surface displacement of one surface of said composite member measured along a longest side thereof, and Dmax being a length of said longest side,
the composite member further comprises a metal coating layer on at least a portion of said substrate, and
said metal coating layer has a concavely curved shape in which a thickness of said metal coating layer is thinnest at a central portion and becomes thick toward each edge portion, in a cross section in a thickness direction of said composite member.
2. The composite member according to claim 1 , wherein said substrate has a SiC content of not less than 50% by volume and not more than 90% by volume.
3. The composite member according to claim 1 , wherein said substrate has a thermal expansion coefficient of not less than 4 ppm/K and not more than 15 ppm/K, and a thermal conductivity of not less than 180 W/m·K.
4. A heat-dissipating member composed of a composite member as recited in claim 1 .
5. A semiconductor device, comprising a heat-dissipating member as recited in claim 4 , and a semiconductor element mounted on the heat-dissipating member.