IP Library › Granted Patent US 9,356,064
Granted Patent B2
US 9,356,064 · App. 14/204,847 · Granted May 31, 2016

Solid state imaging device and manufacturing method, and electronic apparatus

Inventor: Hiroaki Seko (Kanagawa, JP)
Assignee: Sony Corporation
H01L27/1463H01L27/1464H01L27/14621H01L27/14627H01L27/14685H01L27/14687
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Quick Facts
Patent No.
US 9,356,064
App. No.
14/204,847
Granted
May 31, 2016
Kind
B2
Abstract

A solid state imaging device includes a substrate, in which the substrate includes a photoelectric conversion unit that generates a charge according to a light amount of incident light by a pixel unit, an accumulation unit that divides the charge of the pixel unit which is generated in the photoelectric conversion unit and accumulates the charge, a first element isolation unit that is formed at a boundary of the photoelectric conversion unit of the pixel unit, and a second element isolation unit that is formed at a boundary of the accumulation unit of a divided unit of the pixel.

Claims (36)

1. An imaging device comprising:

a plurality of pixels, wherein at least one pixel of the plurality of pixels includes:

a photoelectric conversion unit that generates a charge for the at least one pixel according to an amount of incident light,

a plurality of accumulation units that divides the charge of the at least one pixel generated in the photoelectric conversion unit and accumulates the divided charge, wherein the plurality of accumulation units accumulates the divided charge from the same photoelectric conversion unit of the at least one pixel,

a first element isolation unit that is formed at a boundary of the photoelectric conversion unit of the at least one pixel and between a photoelectric conversion unit of an adjacent pixel, and

a second element isolation unit that is formed between each accumulation unit of the plurality of accumulation units of the at least one pixel and between another accumulation unit of an adjacent pixel.

2. The imaging device according to claim 1 ,

wherein the photoelectric conversion unit is formed on a side of a substrate which is irradiated with the incident light, and

the first element isolation unit is formed on the side of the substrate which is irradiated with the incident light.

3. The imaging device according to claim 1 , further comprising a light shielding unit that is arranged on a substrate of the first element isolation unit to shield the incident light.

4. The imaging device according to claim 1 , wherein a color filter is arranged on a substrate of the photoelectric conversion unit.

5. The imaging device according to claim 1 , further comprising a lens that is arranged on a substrate of the photoelectric conversion unit to concentrate the incident light to the photoelectric conversion unit.

6. The imaging device of claim 1 , wherein the plurality of accumulation units is located between the photoelectric conversion unit and a surface side of a substrate containing the at least one pixel.

7. A method of manufacturing an imaging device, comprising:

forming, on a substrate, a photoelectric conversion unit that generates a charge for a pixel according to an amount of incident light;

forming, on the substrate, a plurality of accumulation units that divides the charge of the pixel generated in the photoelectric conversion unit and accumulates the divided charge, wherein the plurality of accumulation units accumulates the divided charge from the same photoelectric conversion unit of the pixel;

forming, on the substrate, a first element isolation unit at a boundary of the photoelectric conversion unit of the pixel and between a photoelectric conversion unit of an adjacent pixel; and

forming, on the substrate, a second element isolation unit between each accumulation unit of the plurality of accumulation units of the pixel and between another accumulation unit of an adjacent pixel.

8. The method of manufacturing according to claim 7 , further comprising:

forming the photoelectric conversion unit on a side which is irradiated with the incident light, and

forming the first element isolation unit on the side which is irradiated with the incident light.

9. The manufacturing method according to claim 7 , further comprising forming a light shielding unit that is arranged on the substrate of the first element isolation unit to shield the incident light.

10. The manufacturing method according to claim 7 , further comprising forming a color filter on the substrate of the photoelectric conversion unit.

11. The manufacturing method according to claim 7 , further comprising forming a lens on the substrate of the photoelectric conversion unit to concentrate the incident light to the photoelectric conversion unit.

12. An electronic apparatus comprising:

a substrate including a plurality of pixels, wherein at least one pixel of the plurality of pixels includes:

a photoelectric conversion unit that generates a charge for the at least one pixel according to an amount of incident light,

a plurality of accumulation units that divides the charge of the at least one pixel generated in the photoelectric conversion unit and accumulates the divided charge, wherein the plurality of accumulation units accumulates the divided charge from the same photoelectric conversion unit of the at least one pixel,

a first element isolation unit that is formed at a boundary of the photoelectric conversion unit of the at least one pixel and between a photoelectric conversion unit of an adjacent pixel, and

a second element isolation unit that is formed between each accumulation unit of the plurality of accumulation units of the at least one pixel and between another accumulation unit of an adjacent pixel.

13. The electronic apparatus according to claim 12 ,

wherein the photoelectric conversion unit is formed on a side of the substrate which is irradiated with the incident light, and

the first element isolation unit is formed on the side of the substrate which is irradiated with the incident light.

14. The electronic apparatus according to claim 12 , further comprising a light shielding unit that is arranged on the substrate of the first element isolation unit to shield the incident light.

15. The electronic apparatus according to claim 12 , further comprising a color filter arranged on the substrate of the photoelectric conversion unit.

16. The electronic apparatus according to claim 12 , further comprising a lens that is arranged on the substrate of the photoelectric conversion unit to concentrate the incident light to the photoelectric conversion unit.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 4, 2016
From: SONY CORPORATION
To: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
Reel/Frame 039342/0603 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 11, 2014
From: SEKO, HIROAKI
To: SONY CORPORATION
Reel/Frame 032428/0860 →
Priority Claims (1)
JP 2013-054588 · Mar 18, 2013 · national
Continuity (1)
Related Publication 20140264694A1 · Sep 18, 2014