IP Library › Granted Patent US 9,357,676
Granted Patent B2
US 9,357,676 · App. 13/912,764 · Granted May 31, 2016

Cooling device and electronic apparatus

Inventors: Goki Yamaguchi (Kawasaki, JP); Sonomasa Kobayashi (Kawasaki, JP)
Assignee: FUJITSU LIMITED
H05K7/20336F28D15/0233F28D15/0275F28F1/24G06F1/203F04D25/0613
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Quick Facts
Patent No.
US 9,357,676
App. No.
13/912,764
Granted
May 31, 2016
Kind
B2
Abstract

A cooling device includes: a heat dissipating part disposed at an end of a heat transfer member; a heat-receiving plate disposed at the other end of the heat transfer member, provided opposite to a noise-generating part mounted on a circuit board, and thermally coupled to the noise-generating part; and a shielding unit disposed at the other end of the heat transfer member, the shielding unit covering the noise-generating part.

Claims (23)

1. A cooling device comprising:

a heat dissipating part disposed at an end of a heat transfer member;

a heat-receiving plate disposed at the other end of the heat transfer member, provided opposite to a noise-generating part mounted on a circuit board, and thermally coupled to the noise-generating part; and

a shielding member disposed at the other end of the heat transfer member and including a top plate and peripheral walls extending from all respective sides of the top plate to cover the noise-generating part and the other end of the heat transfer member within the peripheral wall, at least one of the peripheral walls having a groove.

2. The cooling device according to claim 1 , wherein the shielding member includes the heat-receiving plate and a peripheral wall provided beside the heat-receiving plate.

3. The cooling device according to claim 1 , wherein the shielding member includes the heat-receiving plate formed by drawing a sheet metal and a peripheral wall provided beside the heat-receiving plate.

4. The cooling device according to claim 1 , wherein the heat-receiving plate is attached to the circuit board through an elastic material.

5. The cooling device according to claim 1 , further comprising,

an extended part configured to cover another noise-generating part different from the noise-generating part that the shielding unit covers.

6. The cooling device comprising according to claim 1 , wherein the other end of the heat transfer member is located on the heat-receiving plate.

7. The cooling device according to claim 1 , wherein the heat transfer member is a heat pipe.

8. An electronic apparatus comprising:

a circuit board on which a noise-generating part is mounted; and

a cooling device, the cooling device includes:

a heat dissipating part disposed at an end of a heat transfer member;

a heat-receiving plate disposed at the other end of the heat transfer member, provided opposite to the noise-generating part mounted on a circuit board, and thermally coupled to the noise-generating part; and

a shielding member disposed at the other end of the heat transfer member and including a top plate and peripheral walls extending from all respective sides of the top plate to cover the noise-generating part and the other end of the heat transfer member within the peripheral walls, at least one of the peripheral walls having a groove.

9. The electronic apparatus according to claim 8 , wherein the shielding member includes the heat-receiving plate and a peripheral wall provided beside the heat-receiving plate.

10. The electronic apparatus according to claim 8 , wherein the shielding member includes the heat-receiving plate formed by drawing a sheet metal and includes a peripheral wall provided beside the heat-receiving plate.

11. The cooling device according to claim 1 , wherein the noise-generating part and the other end of the heat transfer member are disposed between the shielding member and the circuit board.

12. The electronic apparatus according to claim 8 , wherein the noise-generating part and the other end of the heat transfer member are disposed between the shielding member and the circuit board.

13. The cooling device according to claim 1 , wherein the heat transfer member passes through the groove in a direction of the end of the heat transfer member.

14. The electronic apparatus according to claim 8 , wherein the heat transfer member passes through the groove in a direction of the end of the heat transfer member.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 31, 2019
From: FUJITSU LIMITED
To: FUJITSU CLIENT COMPUTING LIMITED
Reel/Frame 048751/0051 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 7, 2013
From: YAMAGUCHI, GOKI; KOBAYASHI, SONOMASA
To: FUJITSU LIMITED
Reel/Frame 030569/0256 →
Priority Claims (1)
JP 2012-216610 · Sep 28, 2012 · national
Continuity (1)
Related Publication 20140092559A1 · Apr 3, 2014