Method of integrating all active and passive optical devices on silicon-based integrated circuit
A method is provided to integrate all active and passive integrated optical devices on a silicon (Si)-based integrated circuit (IC). A Si-based substrate, instead of a Si-on-insulator (SOI) substrate, is used for integrating the devices. Therefore, cost is down and heat dissipation efficiency is enhanced. Besides, rapid melt growth (RMG) is used for solving problems on integrating the electric circuit and the optical devices. The present invention can be used to develop a proactive optical transceivers on a standard chip; or, to fully and compatibly integrate all devices on a circuit for an optical communication chip.
1. A method of integrating all active and passive optical devices on a silicon (Si)-based integrated circuit (IC), comprising steps of:
(a1) providing a Si substrate; obtaining at least one electronic device on said Si substrate; and obtaining a first insulating layer to be covered on said Si substrate and said at least one electronic device;
(b1) pattern-etching said first insulating layer to form a first groove on said Si substrate; obtaining an active-layer semiconductor in said first groove and on said first insulating layer; and obtaining a second insulating layer to be covered on said active-layer semiconductor;
(c1) by using rapid melt epitaxy (RMG), said active-layer semiconductor comprising a filling part and a waveguide part after an annealing process to obtain a layer of a material selected from a group consisting of a single crystal and an alloy on said Si substrate and said at least one electronic device, said filling part being located in said first groove, said waveguide part being located on said first insulating layer and perpendicularly connected with said filling part; and obtaining an optical emitter and an optical receiver; and
(d1) obtaining a third insulating layer to be covered on said optical emitter, said optical receiver, said waveguide part and said first insulating layer; after pattern-etching, obtaining a plurality of second grooves on said at least one electronic device, said optical emitter and said optical receiver; through said second grooves, obtaining a plurality of metal pads on said at least one electronic device, said optical emitter and said optical receiver to input and output electronic signals.
2. The method according to claim 1 ,
wherein said Si substrate is a polycrystalline Si substrate.
3. The method according to claim 1 ,
wherein a material selected from a group consisting of III-V group and IV group is used to fabricate said active-layer semiconductor.
4. The method according to claim 1 ,
wherein said second insulating layer has a melting point greater than that of said active-layer semiconductor.
5. A method of integrating all active and passive optical devices on a Si-based IC, comprising steps of:
(a2) providing a Si substrate; obtaining at least one electronic device and a polycrystalline Si layer on said Si substrate; and obtaining a first insulating layer to be covered on said Si substrate, said at least one electronic device and said polycrystalline Si layer;
(b2) pattern-etching said first insulating layer to obtain a first groove on said polycrystalline Si layer; obtaining an active-layer semiconductor in said first groove and on said first insulating layer; and obtaining a second insulating layer to be covered on said active-layer semiconductor;
(c2) by using RMG, said active-layer semiconductor comprising a filling part and a waveguide part after an annealing process, said filling part being located in said first groove, said waveguide part being located on said first insulating layer and perpendicularly connected with said filling part; obtaining a layer of a material selected from a group consisting of a single crystal and an alloy; pattern-etching said layer of said material until said first insulating layer; separately obtaining an optical emitter and an optical receiver on said waveguide part separated; obtaining a third insulating layer to be covered on said optical emitter and said optical receiver; and obtaining a passive optical waveguide layer on said third insulating layer; and
(d2) obtaining a fourth insulating layer to be covered on said third insulating layer and said passive optical waveguide layer; after pattern-etching, obtaining a plurality of second grooves on said at least one electronic device, said optical emitter and said optical receiver; through said second grooves, obtaining a plurality of metal pads on said at least one electronic device, said optical emitter and said optical receiver to input and output electronic signals.
6. The method according to claim 5 ,
wherein said Si substrate is a polycrystalline Si substrate.
7. The method according to claim 5 ,
wherein a material selected from a group consisting of III-V group and IV group is used to fabricate said active-layer semiconductor.
8. The method according to claim 5 ,
wherein said second insulating layer has a melting point greater than that of said active-layer semiconductor.
9. The method according to claim 5 ,
wherein said passive optical waveguide layer is made of a material selected from a group consisting of amorphous Si (a-Si), Si nitride (SiN), Si oxynitride (SiON) and a material having a refractive index greater than said third and said fourth insulating layers.
10. The method according to claim 5 ,
wherein said passive optical waveguide layer is extended to and overlapped on a part of said optical emitter and said optical receiver.