IP Library Granted Patent US 9,379,102
Granted Patent B2
US 9,379,102 · App. 13/926,553 · Granted Jun 28, 2016

Nitride-based semiconductor device

Inventors: Woo-chul Jeon (Daegu, KR); Ki-yeol Park (Suwon-si, KR); Young-hwan Park (Seoul, KR); Jai-kwang Shin (Anyang-si, KR); Jae-joon Oh (Seongnam-si, KR)
Assignee: Samsung Electronics Co., Ltd.
H01L27/0629H01L21/8252H01L27/0605
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Quick Facts
Patent No.
US 9,379,102
App. No.
13/926,553
Granted
Jun 28, 2016
Kind
B2
Abstract

A nitride-based semiconductor diode includes a substrate, a first semiconductor layer disposed on the substrate, and a second semiconductor layer disposed on the first semiconductor layer. The first and second semiconductor layers include a nitride-based semiconductor. A first portion of the second semiconductor layer may have a thickness thinner than a second portion of the second semiconductor layer. The diode may further include an insulating layer disposed on the second semiconductor layer, a first electrode covering the first portion of the second semiconductor layer and forming an ohmic contact with the first semiconductor layer and the second semiconductor layer, and a second electrode separated from the first electrode, the second electrode forming an ohmic contact with the first semiconductor layer and the second semiconductor layer.

Claims (12)

1. A nitride-based semiconductor diode comprising:

a substrate;

a first semiconductor layer disposed on the substrate;

a second semiconductor layer disposed on the first semiconductor layer, the first and second semiconductor layers including a nitride-based semiconductor, and a first portion of the second semiconductor layer having a thickness thinner than a second portion of the second semiconductor layer;

an insulating layer disposed on the second semiconductor layer;

a first electrode overlapping the first portion of the second semiconductor layer when viewed from a plan view and forming an ohmic contact with the first semiconductor layer and the second semiconductor layer; and

a second electrode separated from the first electrode, the second electrode forming an ohmic contact with the first semiconductor layer and the second semiconductor layer, wherein the first portion of the second semiconductor layer is a recess, and the first electrode fills the recess with the insulating layer therebetween.

2. The nitride-based semiconductor diode of claim 1 , wherein the second semiconductor layer further comprises a third portion that is thicker than the first portion and is thinner than the second portion between an end of the second semiconductor layer contacting the first electrode and the first portion.

3. The nitride-based semiconductor diode of claim 2 , wherein the second semiconductor layer further comprises a fourth portion having a thickness that is substantially identical to a thickness of the second portion between the third portion and the end of second semiconductor layer.

4. The nitride-based semiconductor diode of claim 1 , wherein the first semiconductor layer and the second semiconductor layer form a heterostructure, and a 2-dimensional electron gas is generated in the first semiconductor layer.

5. The nitride-based semiconductor diode of claim 4 , wherein a discontinuous region of a 2-dimensional electron gas is formed in a portion of the first semiconductor layer which corresponds to the first portion of the second semiconductor layer.

6. The nitride-based semiconductor diode of claim 5 , wherein if a voltage is applied to the first electrode, then the discontinuous region is filled with electrons and current flows.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 25, 2013
From: JEON, WOO-CHUL; PARK, KI-YEOL; PARK, YOUNG-HWAN; SHIN, JAI-KWANG; OH, JAE-JOON
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 030683/0886 →
Priority Claims (2)
KR 10-2012-0078957 · Jul 19, 2012 · national
KR 10-2013-0049618 · May 2, 2013 · national
Continuity (2)
Continuation In Part 13734347 · Jan 4, 2013
Related Publication 20140021514A1 · Jan 23, 2014