Semiconductor package

1. A semiconductor device comprising:

a lower package comprising:

a wiring pattern including exposed parts that function as a plurality of connection pads; and

a recognition mark formed in each of at least two of the plurality of connection pads, wherein each said recognition mark has an area less than an area of the corresponding connection pad when viewed from above, and wherein each said recognition mark is a recess or a projection of the corresponding exposed part of the wiring pattern in an outermost surface of the lower package; and

an upper package comprising connection terminals configured to be electrically connected to at least some of the plurality of connection pads.

2. The semiconductor device according to claim 1 , further comprising:

an insulative layer;

wherein the wiring pattern is formed on the insulative layer, and

wherein each said recognition mark includes aperture regions that are formed in the corresponding exposed parts of the wiring pattern to expose the insulative layer underneath the wiring pattern.

3. The semiconductor device according to claim 1 , wherein the recognition mark includes an etched surface or pressed surface formed in exposed part of the wiring pattern and serving as at least the two connection pads.

4. The semiconductor device according to claim 1 , wherein

the plurality of connection pads each have a circular planar shape, and

the recognition mark has a planar shape that differs from the planar shape of the plurality of connection pads.

5. The semiconductor device according to claim 1 , wherein the recognition marks formed in at least two of the plurality of connection pads indicate the type of the lower package.

6. The semiconductor device according to claim 1 , wherein the exposed parts are adapted to be directly connected to the connection terminals of the upper package.

7. The semiconductor device according to claim 1 , wherein the exposed parts are pad surfaces of the plurality of connection pads, the pad surfaces being identical in shape.

8. A semiconductor device comprising:

a lower package comprising:

a substrate;

a wiring layer including a plurality of connection pads formed on the substrate and including marked connection pads and non-marked connection pads in an outermost surface of the lower package, wherein the marked connection pads and the non-marked connection pads have the same shape and the same area, as viewed in a direction perpendicular to the substrate; and

recognition marks respectively formed in the marked connection pads, each said recognition mark having an area less than an area of the corresponding marked connection pad when viewed from above, wherein each said recognition mark is a recess or a projection of the wiring pattern in the outermost surface of the lower package; and

an upper package comprising connection terminals configured to be electrically connected to at least some of the plurality of connection pads.

9. The semiconductor device according to claim 8 , further comprising:

a solder resist layer including a plurality of openings respectively corresponding to the plurality of connection pads;

wherein each said recognition mark is arranged within the corresponding opening.

10. The semiconductor device according to claim 9 , wherein each said recognition mark has a contour that is entirely arranged within the corresponding opening.

11. The semiconductor device according to claim 9 , wherein the recognition mark is smaller than corresponding opening.

12. The semiconductor device according to claim 9 , wherein the recognition mark and the corresponding opening have different contours.

13. The semiconductor device according to claim 9 , wherein the lower package is a polygon, and two of the marked connection pads are respectively arranged proximal to two opposing corners of the polygon.

14. The semiconductor device according to claim 8 , wherein the recognition marks indicate the type of the lower package.