Organic light emitting diode display device and fabricating method thereof

1. An organic light emitting diode display device comprising:

a first substrate defined into an emission region and a non-emission region;

a first electrode disposed on the first substrate;

a bank pattern configured to expose a part of the first electrode opposite to the emission region;

an organic emission layer disposed on the exposed part of the first electrode corresponding to the emission region; and

a second electrode which includes a first conductive layer formed on the organic emission layer and a second conductive layer on the first conductive layer,

wherein the first conductive layer includes an alloy of magnesium (Mg) and silver (Ag), and the second conductive layer includes silver (Ag), and

wherein the bank pattern exposes a part of an upper surface of the first electrode within the non-emission region.

2. The organic light emitting diode display device of claim 1 , wherein the first conductive layer and the second conductive layer of the second electrode are disposed on an entire surface of the first substrate.

3. The organic light emitting diode display device of claim 1 , wherein the first conductive layer has a thickness in a range of about 2 Ř200 Å.

4. The organic light emitting diode display device of claim 1 , wherein the second conductive layer has a thickness in a range of about 50 Ř300 Å.

5. The organic light emitting diode display device of claim 1 , wherein the bank pattern is formed on a planarization film provided with the first electrode.

6. The organic light emitting diode display device of claim 1 , further comprising an oxide layer disposed between the exposed part of the upper surface of the first electrode and the second electrode.

7. The organic light emitting diode display device of claim 1 , wherein the organic emission layer includes a hole injection layer, a hole transport layer, an emission material layer, an electron transport layer and an electron injection layer which are sequentially formed on the first electrode.

8. The organic light emitting diode display device of claim 1 , wherein the first electrode includes a reflective layer.

9. The organic light emitting diode display device of claim 6 , wherein the first conductive layer overlaps with the first electrode, and the second conductive layer surrounds the first conductive layer and overlaps with the first electrode.

10. The organic light emitting diode display device of claim 9 , wherein the oxide layer is disposed in a close region between the exposed part of the first electrode and the first conductive layer and another close region between the exposed part of the first electrode and the second conductive layer within the non-emission region.

11. The organic light emitting diode display device of claim 10 , wherein the oxide layer includes silver oxide (Ag x O).

12. A method of fabricating an organic light emitting diode display device, the method comprising:

forming a first electrode on a first substrate which is defined into an emission region and a non-emission region;

forming a bank pattern configured to expose a part of the first electrode opposite to the emission region;

forming an organic emission layer on the exposed part of the first electrode within the emission region; and

forming a second electrode which includes a first conductive layer formed on an entire surface of the first substrate provided with the organic emission layer and a second conductive layer formed on the first conductive layer,

wherein the first conductive layer is formed from an alloy of magnesium (Mg) and silver (Ag), and the second conductive layer is formed from silver (Ag),

wherein the formation of the bank pattern allows a part of an upper surface of the first electrode within the non-emission region to be exposed.

13. The method of claim 12 ,

wherein the formation of the second electrode includes forming the first conductive layer in contact with the exposed part of the upper surface of the first electrode within the non-emission region, and forming the second conductive layer to surround the first conductive layer within the first conductive layer and come in contact with the exposed part of the upper surface of the first electrode within the non-emission region.

14. The method of claim 13 , wherein the formation of the bank pattern allows the upper surface of the first electrode to be partially exposed due to a foreign material in the non-emission region.

15. The method of claim 13 , further comprising:

forming an oxide layer between the first electrode and the first and second conductive layers within the non-emission region by applying a reverse bias to the first substrate provided with the first and second conductive layers.

16. The method of claim 13 , further comprising:

forming an oxide layer between the first electrode and the first and second conductive layers within the non-emission region by performing a heat treatment for the first substrate provided with the first and second conductive layers and simultaneously applying a reverse bias to the first substrate.

17. The method of claim 13 , wherein the oxide layer is formed from silver oxide (Ag x O).

18. The method of claim 15 , wherein the reverse bias is set to a voltage range of about −1V through −30V.

19. The method of claim 16 , wherein the reverse bias is set to a voltage range of about −1V through −30V.

20. The method of claim 13 , wherein the first conductive layer is formed to have a thickness in a range of about 2 Ř200 Å, and the second conductive layer is formed to have a thickness in a range of about 50 Ř300 Å.