Wireless module with integrated antenna by using rigid-flex board
A wireless module includes a flex substrate, an antenna integrated in the flex substrate and electrically connected to a signal layer and a ground layer of the flex substrate, a first rigid substrate stacked on one side of the flex substrate remote from the antenna, and a communication unit mounted on the first rigid substrate and electrically connected to the signal layer. Thus, the flex substrate and the first rigid substrate are laminated into a Rigid-Flex board. Further, the signal layer and the ground layer are continuously arranged in the same flex substrate. It will be helpful in decreasing the uncertainty and loss of RF signal transmission path, reducing component costs, facilitating optimization of the antenna and reducing the module size.
1. A wireless module with integrated antenna by using rigid-flex board, comprising:
a flex substrate comprising opposing first surface and second surface, a signal layer and a ground layer;
an antenna integrated in one side of said flex substrate, said antenna comprising a radiator and a feed-in segment and a grounding segment extended from said radiator and respectively electrically connected to said signal layer and said ground layer;
a first rigid substrate directly stacked on at least a part of said first surface of said flex substrate at an opposite side remote from said antenna; and
a communication unit integrated in said first rigid substrate and electrically connected to said signal layer;
wherein said antenna and said signal layer are located on said first surface.
2. The wireless module with integrated antenna by using rigid-flex board as claimed in claim 1 , wherein said ground layer is located on said second surface.
3. The wireless module with integrated antenna by using rigid-flex board as claimed in claim 1 , wherein said communication unit comprises at least one communication IC.
4. The wireless module with integrated antenna by using rigid-flex board as claimed in claim 3 , wherein each said communication IC is packaged on said first rigid substrate using the semiconductor packaging technique of SiP (System in Package).
5. The wireless module with integrated antenna by using rigid-flex board as claimed in claim 3 , wherein each said communication IC is packaged on said first rigid substrate using the semiconductor packaging technique of MCP (Multi-Chip Package).
6. The wireless module with integrated antenna by using rigid-flex board as claimed in claim 3 , wherein each said communication IC is packaged on said first rigid substrate using the semiconductor packaging technique of PoP (Package on Package).
7. The wireless module with integrated antenna by using rigid-flex board as claimed in claim 3 , further comprising a second rigid substrate stacked on said second surface.
8. The wireless module with integrated antenna by using rigid-flex board as claimed in claim 1 , wherein said antenna is selected from the group of planar inverted-F antenna, near-field communication antenna, monopole antenna and dipole antenna.
9. The wireless module with integrated antenna by using rigid-flex board as claimed in claim 1 , further comprising a grounding component, said grounding component comprising a conducting structure connected to the connection between said ground layer of said flex substrate and said grounding segment of said antenna.