Image sensor chips

1. An image sensor chip comprising:

a first wafer including an image sensor having a plurality of sub-pixels, each of the plurality of sub-pixels being configured to detect at least one photon and to output a sub-pixel signal according to a result of the detection, the plurality of sub-pixels being grouped into first through n-th sub-pixel groups, each of the first through n-th sub-pixel groups including at least one of the plurality of sub-pixels; and

a second wafer including an image processor, the first wafer and the second wafer being formed in a wafer stack structure;

the image processor being configured to

process sub-pixel signals for each of the plurality of sub-pixels to generate first through n-th sub-pixel images, the first through n-th sub-pixel images corresponding to the respective first through n-th sub-pixel groups;

perform scaling and registration on the first through n-th sub-pixel images to generate a high-resolution image;

scale the high-resolution image to a size of at least one of the first through n-th sub-pixel images;

compare the scaled high-resolution image with one of the first through n-th sub-pixel images; and

correct a reconstruction error based on the comparing.

2. The image sensor chip of claim 1 , wherein the image sensor chip further includes,

a micro lens array having first through n-th micro lenses corresponding to the first through n-th sub-pixel groups.

3. The image sensor chip of claim 2 , wherein the image processor is further configured to generate angular information based on a comparison between at least two of first through n-th sub-pixel images output from the first through n-th sub-pixel groups.

4. The image sensor chip of claim 3 , wherein the image processor is further configured to generate depth data corresponding to the high-resolution image based on the angular information.

5. The image sensor chip of claim 3 , wherein the image processor is further configured to refocus the high-resolution image based on the angular information.

6. The image sensor chip of claim 1 , wherein

the first wafer includes a plurality of dies, at least one die of the plurality of dies including the image sensor; and

the second waver includes another plurality of dies, at least one die of the other plurality of dies including the image processor.

7. The image sensor chip of claim 3 , wherein the angular information includes direction angles of a light source in the at least two sub-pixel images.

8. The image sensor chip of claim 7 , wherein the image processor is further configured to generate the angular information based on determined relative positions of the first through n-th sub-pixel groups on the first wafer.

9. The image sensor chip of claim 8 , wherein the image processor is further configured to determine a relative distance between the light source and the plurality of sub-pixels based on the angular information.

10. The image sensor chip of claim 9 , wherein the image processor is configured to,

determine a virtual image plane based on the determined relative distance, and

generate the high-resolution image based on the virtual image plane.

11. An image sensor chip comprising:

a first wafer including an image sensor having a plurality of sub-pixels and a plurality of pixels, each pixel including at least one of the plurality of sub-pixels, each of the plurality of sub-pixels being configured to detect at least one photon, and to output a sub-pixel signal according to a result of the detection, the plurality of sub-pixels being grouped into first through n-th sub-pixel groups, each of the first through n-th sub-pixel groups including at least one of the plurality of sub-pixels, the first through n-th sub-pixel groups being grouped into first through m-th pixel groups, each of the first through m-th pixel groups including at least one of the first through n-th sub-pixel groups; and

a second wafer including an image processor, the first wafer and the second wafer being in a wafer stack structure;

the image processor being configured to

process sub-pixel signals for each pixel to generate first through m-th pixel images, the first through m-th pixel images corresponding to the respective first through m-th pixel groups;

perform scaling and registration on the first through m-th pixel images to generate a high-resolution image;

scale the high-resolution image to a size of at least one of the first through m-th pixel images;

compare the scaled high-resolution image with one of the first through m-th pixel images; and

correct a reconstruction error based on the comparing.

12. The image sensor chip of claim 11 , wherein the image sensor chip further includes,

a micro lens array including first through m-th micro lenses corresponding to the first through m-th pixel groups.

13. The image sensor chip of claim 12 , wherein the image processor is further configured to generate angular information based on a comparison between at least two of first through m-th pixel images output from the first through m-th pixel groups.

14. The image sensor chip of claim 13 , wherein the image processor is further configured to generate depth data corresponding to the high-resolution image based on the angular information.

15. The image sensor chip of claim 13 , wherein the image processor is further configured to refocus the high-resolution image based on the angular information.

16. The image sensor chip of claim 11 , wherein each of the plurality of sub-pixels includes one transistor.

17. An image sensor chip comprising: a first wafer including an image sensor having a plurality of sub-pixel groups of a sub-pixel array configured to generate sub-pixel signals; and

a second wafer including an image processor configured to,

generate a plurality of sub-pixel images of an object based on sub-pixel signals output from the plurality of sub-pixel groups of the sub-pixel array,

generate angular information associated with at least a first portion of the object based on a comparison between at least two of the plurality of sub-pixel images,

generate depth data associated with at least the first portion of the object based on the angular information,

generate a resultant image based on the plurality of sub-pixel images using the angular information and the depth data,

scale and register the resultant image to generate a high-resolution image,

scale the high-resolution image to a size of at least one of the plurality of sub-pixel images,

compare the scaled high-resolution image with one of the plurality of sub-pixel images, and

correct a reconstruction error based on the comparing;

wherein the first wafer and the second wafer are formed in a wafer stack structure.

18. The image sensor chip of claim 17 , wherein the angular information associated with the first portion of the object includes position information associated with sub-pixels in the plurality of sub-pixel groups having sensed the first portion of the object.

19. The image sensor chip of claim 17 , wherein the angular information associated with the first portion of the object includes a relative position of the plurality of sub-pixel groups in the sub-pixel array.

20. The image sensor chip of claim 17 , wherein the image processor is further configured to scale and register the resultant image to generate a high-resolution image.