Semiconductor device including a gate structure wrapped around a fin structure
View Patent ↗Methods and structure for a semiconductor device is disclosed, which provides a semiconductor device that includes an integral semiconductor fin structure having a middle section defining a channel region of the semiconductor device. The middle section includes an embedded root portion protruding from an insulating surface on a substrate and a suspended overhead portion arranged above the root portion, which is separated from the overhead portion by a predetermined distance. The root portion and the overhead portion respectively define a substantially identical channel direction. The device further includes a gate structure disposed over the fin structure at the middle section. The gate structure wraps around a cross-section of the overhead portion and caps over the protruded portion of the root portion.
1. A semiconductor device, comprising:
an insulating surface;
a fin structure including
a root portion arranged above the insulating surface, and
an overhead portion arranged above the root portion and separated from the root portion, wherein the root portion and the overhead portion define a cross section that substantially resembles an exclamation mark; and
a gate structure wrapping around the overhead portion and the root portion.
2. The device of claim 1 , wherein the overhead portion defines a channel region and a source/drain region, the device further comprising an arch structure that separates the channel region from the source/drain region.
3. The device of claim 1 , wherein the gate structure includes a gate dielectric layer.
4. A semiconductor device, comprising:
a fin structure including
a root portion, and
an overhead portion arranged above the root portion and separated from the root portion;
a gate structure wrapping around the overhead portion and including a gate dielectric; and
an insulating structure arranged between the root portion and the gate dielectric of the gate structure.
5. The device of claim 4 , wherein the overhead portion defines a channel region and a source/drain region, the device further includes an arch structure that separates the channel region from the source/drain region.
6. A semiconductor device comprising:
a substrate including lower and upper substrate portions;
a fin structure formed from the upper substrate portion of the substrate and including
a root portion that extends from the lower substrate portion of the substrate, and
an overhead portion that is above and separated from the root portion;
a gate structure wrapped around the overhead portion of the fin structure;
a source/drain region at an end section of the overhead portion of the fin structure; and
an arch structure between the gate structure and the source/drain region.
7. The semiconductor device of claim 6 , wherein the gate structure further wraps around the root portion of the fin structure.
8. The semiconductor device of claim 6 , further comprising a spacer layer between the root portion of the fin structure and the gate structure.
9. The semiconductor device of claim 6 , further comprising an interlayer dielectric between the root portion of the fin structure and the gate structure.
10. A semiconductor device comprising:
a substrate including lower and upper substrate portions;
a fin structure formed from the upper substrate portion of the substrate and including
a root portion that extends from the lower substrate portion of the substrate, and
an overhead portion that is above and separated from the root portion;
a gate structure wrapped around the overhead portion of the fin structure and including a gate dielectric; and
a dielectric layer between the root portion of the fin structure and the gate structure and having the same material as the gate dielectric of the gate structure.
11. The semiconductor device of claim 6 , wherein the root portion of the fin structure is partially oxidized.
12. A semiconductor device comprising:
a substrate including lower and upper substrate portions;
a fin structure formed from the upper substrate portion of the substrate and including
a root portion that extends from the lower substrate portion of the substrate, and
an overhead portion that is above and separated from the root portion;
a gate structure wrapped around the overhead portion of the fin structure; and
an epitaxial layer grown on the overhead portion of the fin structure.
13. The semiconductor device of claim 6 , further comprising a shallow trench isolation (STI) feature around the root portion of the fin structure.