Integrated package forming wide sense gap micro electro-mechanical system microphone and methodologies for fabricating the same
A micro electro-mechanical system (MEMS) microphone is provided. The microphone includes: a package substrate having a port disposed through the package substrate, wherein the port is configured to receive acoustic waves; and a lid coupled to the substrate and forming a package. The MEMS microphone also includes a MEMS acoustic sensor disposed in the package and positioned such that the acoustic waves receivable at the port are incident on the MEMS acoustic sensor. The MEMS acoustic sensor includes: a back plate positioned over the port at a first location within the package; and a diaphragm positioned at a second location within the package, wherein a distance between the first location and the second location forms a defined sense gap, and wherein the MEMS microphone is designed to withstand a bias voltage between the diaphragm and the back plate greater than or equal to about 15 volts.
1. A micro electro-mechanical system (MEMS) microphone, comprising:
a package substrate having a port disposed through the package substrate, wherein the port is configured to receive acoustic waves;
a lid mounted to the package substrate and forming a package; and
a MEMS acoustic sensor disposed in the package and coupled to the package substrate, wherein the MEMS acoustic sensor is positioned such that the acoustic waves receivable at the port are incident on the MEMS acoustic sensor, and wherein the MEMS acoustic sensor comprises:
a back plate positioned over the port at a first location within the package; and
a diaphragm positioned at a second location within the package, wherein a distance between the first location and the second location forms a defined sense gap, and wherein the MEMS microphone is designed to withstand a bias voltage between the diaphragm and the back plate greater than 20 volts.
2. The MEMS microphone of claim 1 , further comprising:
an application specific integrated circuit (ASIC) disposed within the package and electrically coupled to, and configured to process information generated by, the MEMS acoustic sensor.
3. The MEMS microphone of claim 1 , wherein a width of the defined sense gap is at least 3 microns, wherein the width is a distance between the first location and the second location.
4. The MEMS microphone of claim 1 , wherein the back plate and at least a portion of the diaphragm are substantially parallel to one another.
5. The MEMS microphone of claim 1 , further comprising a post coupled between the diaphragm and the back plate.
6. The MEMS microphone of claim 1 , wherein a resonant frequency of the diaphragm is greater than or equal to about 32 kilohertz.
7. The MEMS microphone of claim 1 , wherein the MEMS microphone has a resonant frequency within a range from about 20 kilohertz to about 40 kilohertz.
8. The MEMs microphone of claim 1 , wherein the diaphragm includes at least one spring.