Multilayer ceramic electronic component and method for manufacturing multilayer ceramic electronic component
A multilayer ceramic electronic component achieves a high electrostatic capacitance and includes an Al inner electrode superior in smoothness and conductivity. The multilayer ceramic electronic component includes a multilayer body including a plurality of stacked ceramic layers and a plurality of inner electrodes arranged along certain interfaces between the ceramic layers and containing Al as a main component, and an outer electrode located on an outer surface of the multilayer body. A surface of the inner electrode is covered with a layer including a noble metal or Ti as a main component.
1. A multilayer ceramic electronic component, comprising:
a multilayer body including stacked ceramic layers and a plurality of inner electrodes arranged along interfaces between the ceramic layers and including Al as a main component;
an outer electrode located on an outer surface of the multilayer body; and
a layer arranged to cover a main surface of at least one of the plurality of inner electrodes and consisting essentially of a noble metal or Ti; wherein
the layer arranged to cover the main surface of at least one of the plurality of inner electrodes is provided in a plurality, and a pair of the layers are arranged respectively above and below the at least one of the plurality of inner electrodes.
2. The multilayer ceramic electronic component according to claim 1 , wherein the noble metal is Ag.
3. The multilayer ceramic electronic component according to claim 1 , wherein a main component of each of the ceramic layers is a titanate barium-based perovskite compound.
4. The multilayer ceramic electronic component according to claim 1 , wherein the multilayer ceramic electronic component is a multilayer ceramic capacitor.
5. The multilayer ceramic electronic component according to claim 1 , wherein each of the ceramic layers further includes an oxide containing Bi as an auxiliary component.
6. The multilayer ceramic electronic component according to claim 1 , wherein the plurality of inner electrodes include an Al alloy.
7. The multilayer ceramic electronic component according to claim 1 , wherein a content ratio of Al in each of the plurality of inner electrodes is about 70% by mole or higher.
8. The multilayer ceramic electronic component according to claim 1 , wherein a content ratio of Al in each of the plurality of inner electrodes is about 90% by mole or higher.
9. The multilayer ceramic electronic component according to claim 1 , further comprising Al 2 O 3 layers disposed on the inner electrodes.
10. The multilayer ceramic electronic component according to claim 9 , wherein a thickness of the Al 2 O 3 layers is about 0.25% or greater of a thickness of the inner electrodes.
11. The multilayer ceramic electronic component according to claim 1 , wherein the noble metal is one of Pd, Au, Pt and an alloy of one of Pd, Au, and Pt.
12. The multilayer ceramic electronic component according to claim 1 , wherein the multilayer ceramic electronic component is made of at least one of a titanate barium-based material, a lead titanate-based material, a lead titanate zirconate-based material, an alumina-based glass ceramic material, a ferrite, and a transition-metal oxide-based semiconductor ceramic material.
13. The multilayer ceramic electronic component according to claim 1 , wherein the multilayer ceramic electronic component is one of a multilayer ceramic capacitor, a multilayer piezoelectric element, a multilayer thermistor element, a multilayer chip coil, and a ceramic multilayer substrate.
14. The multilayer ceramic electronic component according to claim 1 , wherein pairs of the layers are arranged above and below each respective one of the plurality of inner electrodes.