Flexible display apparatus
A flexible display apparatus includes a plurality of pixels on a display area of a flexible substrate. A pad area is on a non-display area of the flexible substrate. A driving integrated circuit is electrically connected to the pad area. A support layer is on a surface of the flexible substrate opposite to a surface facing the driving integrated circuit. An adhesion layer attaches the support layer to the substrate. The adhesion layer has a first thickness in an area corresponding to the driving integrated circuit, and a second thickness in another area. The second thickness is less than the first thickness.
1. A flexible display apparatus, comprising:
a flexible substrate;
a plurality of pixels on a display area of the flexible substrate;
a pad area on a non-display area of the flexible substrate;
a driving integrated circuit electrically connected to the pad area;
a support layer on a surface of the flexible substrate opposite to a surface facing the driving integrated circuit; and
an adhesion layer attaching the support layer to the flexible substrate, wherein the adhesion layer has a first thickness in an area corresponding to the driving integrated circuit and a second thickness in another area, and wherein the first thickness is less than the second thickness.
2. The apparatus as claimed in claim 1 , wherein the first thickness is less than 12% of the second thickness.
3. The apparatus as claimed in claim 1 , wherein the support layer projects from the first area toward the flexible substrate.
4. The apparatus as claimed in claim 3 , wherein an upper surface of the adhesion layer is substantially flat.
5. The apparatus as claimed in claim 1 , wherein the flexible substrate includes a concave area in the first area.
6. The apparatus as claimed in claim 5 , wherein the driving integrated circuit is within the concave area.
7. The apparatus as claimed in claim 1 , wherein:
the pad area includes a plurality of pads,
the driving integrated circuit includes an integrated circuit chip and a plurality of bumps electrically connected to the plurality of pads, and
the adhesion layer has the second thickness in the display area.
8. The apparatus as claimed in claim 7 , wherein the pad area is coupled to the driving integrated circuit by a conducting film.
9. The apparatus as claimed in claim 8 , wherein:
the conducting film includes an adhesive insulating resin layer and conductive balls dispersed in the adhesive insulating resin layer,
each of the conductive balls has the diameter of about 2 μm to about 4 μm, and
the plurality of pads and the plurality of bumps are electrically connected via the conductive balls.
10. The apparatus as claimed in claim 9 , wherein the first thickness is less than an average diameter of the conductive balls.
11. The apparatus as claimed in claim 1 , wherein the adhesion layer includes one or more getters.
12. The apparatus as claimed in claim 1 , wherein the flexible substrate is a single layer including polyimide.
13. The apparatus as claimed in claim 1 , wherein the support layer includes at least one of polyethyleneterepthalate (PET), polystyrene (PS), polyethylene napthalate (PEN), polyethersulfone (PES), or polyethylene (PE).
14. The apparatus as claimed in claim 1 , wherein each pixel includes:
an organic light-emitting device, and
a thin film transistor electrically connected to the organic light-emitting device.
15. The apparatus as claimed in claim 14 , wherein:
the thin film transistor includes an active layer, a gate electrode, a source electrode, and a drain electrode, and
the pad area includes a same material as the source electrode and the drain electrode.
16. The apparatus as claimed in claim 1 , further comprising:
an encapsulation layer encapsulating the display area,
wherein the encapsulation layer includes an inorganic layer and an organic layer.
17. A display, comprising:
a flexible substrate;
a support layer on the flexible substrate;
an integrated circuit on the flexible substrate; and
an adhesion layer between the support layer and the flexible substrate,
wherein the adhesion layer has a first thickness in an area corresponding to the integrated circuit and a second thickness in another area, the first thickness different from the second thickness in the another area.
18. The display as claimed in claim 17 , wherein the first thickness is less than the second thickness.
19. The display as claimed in claim 17 , wherein the support layer and the integrated circuit are on opposing surfaces of the flexible substrate.
20. The display as claimed in claim 17 , further comprising:
an intermediate layer between the integrated circuit and the flexible substrate, the intermediate layer including conductive particles dispersed throughout a host material.