Method of manufacturing a sensor insole

1. A method for manufacturing a sensor insole, the method comprising the steps of:

providing a printed circuit board that includes a processor and a memory;

providing a plurality of force sensors, each having a wire for operably connecting the force sensor to the printed circuit board;

operably connecting the wires of each of the force sensors to the printed circuit board;

providing a felt layer;

positioning the printed circuit board and the force sensors on the felt layer in a predetermined configuration;

providing a mold that defines a planar internal cavity;

positioning the felt layer in the mold; and

injecting a urethane foam into the planar internal cavity of the mold to form a sensor sheet that includes a urethane layer, the felt layer, and the printed circuit board and the force sensors positioned therebetween.

2. The method of claim 1 , further comprising the step of positioning the wires of each of the force sensors in an S-curve configuration as part of the predetermined configuration.

3. The method of claim 1 , further comprising the step of attaching the printed circuit board and the force sensors to the felt layer such that they retain the predetermined configuration.

4. The method of claim 1 , further comprising the steps of:

providing at least one inductive charging coil operably connected to a battery;

operably connecting the battery to the printed circuit board;

positioning the at least one inductive charging coil and the battery on the felt layer prior to positioning the felt layer into the mold and injecting the urethane foam.

5. The method of claim 1 , further comprising the steps of:

soldering the wires of each of the force sensors to the printed circuit board; and

covering connection of the wire and the printed circuit board with an epoxy layer.

6. The method of claim 1 , further comprising the steps of:

providing a sensor jig that includes guide features for positioning the printed circuit board and the force sensors in the predetermined configuration;

positioning the printed circuit board and the force sensors on the sensor jig in the predetermined configuration; and

attaching the printed circuit board and the force sensors to the felt layer such that they retain the predetermined configuration established by the sensor jig.

7. A method for manufacturing a sensor insole, the method comprising the steps of:

providing a printed circuit board that includes a processor and a memory;

providing a plurality of force sensors, each having a wire for operably connecting the force sensor to the printed circuit board;

providing a battery;

soldering the wires of each of the force sensors to the printed circuit board;

covering at least a part of the printed circuit board and the wire with an epoxy layer;

providing a sensor jig that includes guide features for positioning the printed circuit board and the force sensors in a predetermined configuration;

positioning the printed circuit board and the force sensors on the sensor jig in the predetermined configuration;

providing a felt layer;

attaching the printed circuit board and the force sensors to the felt layer such that they retain the predetermined configuration established by the sensor jig;

providing a mold that defines a planar internal cavity;

positioning the felt layer in the mold;

injecting a urethane foam into the planar internal cavity of the mold to form a sensor sheet that includes a urethane layer, the felt layer, and the printed circuit board and the force sensors positioned therebetween;

removing the sensor sheet from the mold; and

cutting the sensor insoles from the sensor sheet.

8. The method of claim 7 , further comprising the steps of:

positioning the printed circuit board in an epoxy mold that substantially surrounds the printed circuit board;

injecting an epoxy into the epoxy mold to substantially surround the printed circuit board with an epoxy layer;

removing the printed circuit board from the epoxy mold; and

allowing the epoxy layer to cure.

9. The method of claim 7 , further comprising the step of positioning the wires of each of the force sensors in an S-curve configuration as part of the predetermined configuration.

10. The method of claim 7 , further comprising the step of providing at least one accelerometer integrated with the printed circuit board.

11. The method of claim 7 , providing at least one inductive charging coil connected to the battery.

12. The method of claim 7 , further comprising the steps of:

providing a calibration device to apply force to the sensor insole and a calibration computer to control the calibration process;

placing the sensor insole in the calibration device;

applying force to the sensor insole with the calibration device;

determining the force reported by each of the force sensors;

calibrating each of the force sensors; and

saving the calibration data on the calibration computer.

13. The method of claim 12 , further comprising the steps of:

providing a production database;

associating each sensor insole with a unique identification code;

storing the unique identification code in the production database;

storing calibration information of each of the force sensors in the production database associated with the unique identification code;

pairing two of the sensor insoles;

confirming that calibration information has been received for each of the force sensors for each of the two sensor insoles that are being paired; and

confirming the pairing if all of the calibration information is in the production database, or, if not all of the calibration information is in the production database, refusing the pairing.