High-speed germanium on silicon avalanche photodiode
A high-speed germanium on silicon (Ge/Si) avalanche photodiode may include a substrate layer, a bottom contact layer disposed on the substrate layer, a buffer layer disposed on the bottom contact layer, an electric field control layer disposed on the buffer layer, an avalanche layer disposed on the electric field control layer, a charge layer disposed on the avalanche layer, an absorption layer disposed on the charge layer, and a top contact layer disposed on the absorption layer. The electric field contact layer may be configured to control an electric field in the avalanche layer.
1. An apparatus, comprising:
a germanium on silicon (Ge/Si) avalanche photodiode comprising:
a substrate;
a bottom contact layer disposed on the substrate;
a buffer layer disposed on the bottom contact layer;
an electric field control layer disposed on the buffer layer;
an avalanche layer disposed on the electric field control layer;
a charge layer disposed on the avalanche layer;
an absorption layer disposed on the charge layer; and
a top contact layer disposed on the absorption layer,
wherein the electric field contact layer is configured to control an electric field in the avalanche layer.
2. The apparatus of claim 1 , wherein the substrate comprises a bulk Si wafer or a silicon on insulator (SOI) wafer, wherein the bottom contact layer comprises a Si contact layer heavily doped with n-type dopants, wherein the buffer layer comprises an intrinsic Si layer with unintentional doping, an electric field control layer comprises a Si electric field control layer doped with n-type dopants, wherein the avalanche layer comprises an intrinsic Si avalanche layer, wherein the charge layer comprises a Si charge layer doped with p-type dopants, wherein the absorption layer comprises a Ge absorption layer, and wherein the top contact layer comprises an amorphous Si contact layer heavily doped with p-type dopants.
3. The apparatus of claim 1 , wherein the electric field control layer comprises a depleted electric field control layer.
4. The apparatus of claim 1 , wherein a total thickness of the buffer layer corresponds to an electron transit time in the buffer layer.
5. The apparatus of claim 4 , wherein the electron transit time in the buffer layer is less than or equal to a total transit time of hole transporting in the n field control layer, the avalanche layer, the charge layer, and the absorption layer.
6. The apparatus of claim 1 , wherein the electric field control layer comprises a first central region and a first surrounding region that surrounds the first central region, wherein the first central region is doped and functions as an active region for optical signals, and wherein the first surrounding region is intrinsic.
7. The apparatus of claim 6 , wherein the first central region is doped with n-type dopants.
8. The apparatus of claim 6 , wherein the charge layer comprises a second central region and a second surrounding region that surrounds the second central region, wherein a doping concentration of the second surrounding region is greater than a doping concentration of the second central region.
9. The apparatus of claim 8 , wherein the second central region and the second surrounding region are doped with p-type dopants.
10. The apparatus of claim 1 , wherein a thickness of the avalanche layer is in a range of approximately 50 nm˜250 nm.
11. The apparatus of claim 10 , wherein a doping concentration of the avalanche layer is less than or equal to 5×10 16 /cm 3 .
12. The apparatus of claim 1 , wherein a thickness of the charge layer is in a range of approximately 30 nm˜150 nm.
13. The apparatus of claim 12 , wherein a doping concentration of the charge layer is in a range of approximately 1×10 17 /cm 3 ˜5×10 18 /cm 3 .
14. The apparatus of claim 1 , wherein a thickness of the electric field control layer is in a range of approximately 50 nm˜400 nm.
15. The apparatus of claim 14 , wherein a doping concentration of the electric field control layer is in a range of approximately 5×10 16 /cm 3 ˜3×10 18 /cm 3 .
16. The apparatus of claim 1 , wherein a thickness of the buffer layer is in a range of approximately 100 nm˜600 nm.
17. The apparatus of claim 16 , wherein a doping concentration of the buffer layer is in a range of 1×10 15 /cm 3 ˜1×10 19 /cm 3 .
18. The apparatus of claim 1 , wherein the Ge/Si avalanche photodiode comprises a normal incident device.
19. The apparatus of claim 1 , wherein the Ge/Si avalanche photodiode comprises a waveguide device.
20. The apparatus of claim 1 , wherein the absorption layer comprises Ge, GeSn, GeSi, GeSiSn or one or more other III-V compound semiconductor materials.