Anisotropic conductive adhesive, light emitting device, and method for producing anisotropic conductive adhesive
Provided is a light emitting device high in the intensity of emitted light. A blue LED chip having a peak of emitted light in a wavelength range of at least 360 nm and at most 500 nm is adhered to an electrode substrate by an anisotropic conductive adhesive. A light reflecting layer made of a silver alloy on a surface of each conductive particle contained in the anisotropic conductive adhesive, and has high reflectance with respect to blue light. The light reflecting layer is formed by sputtering of a sputtering target that contains Ag, Bi, and Nd with the content ratio of Bi set to at least 0.1 weight % (wt %) and at most 3.0 wt % and the content ratio of Nd set to at least 0.1 weight % and at most 2.0 wt % with respect to the total weight of Ag, Bi, and Nd of 100 wt %. The conductive particle has high anti-migration properties.
1. An anisotropic conductive adhesive for electrically connecting an electrode substrate to an LED element having a peak which is a maximum intensity of emitted light, positioned within a range of a wavelength at least 360 nm and at most 500 nm, by adhering electrodes of the LED element to electrodes of the electrode substrate, the anisotropic conductive adhesive comprising:
conductive particles; and
an adhesive binder,
wherein each of the conductive particles includes
a resin particle,
a base layer formed on a surface of the resin particle by electrolytic plating method, and
a conductive light reflecting layer formed on a surface of the base layer by sputtering method, the conductive light reflecting layer including Ag, Bi, and Nd, and
wherein the light reflecting layer is formed by sputtering of a sputtering target which contains Ag, Bi, and Nd having a content ratio of Bi set to at least 0.1 weight % and at most 3.0 weight % and a content ratio of Nd set to at least 0.1 weight % and at most 2.0 weight % with respect to a total weight of Ag, Bi, and Nd of 100 weight %.
2. The anisotropic conductive adhesive according to claim 1 , wherein the anisotropic conductive adhesive is a cured anisotropic conductive adhesive, and the cured anisotropic conductive adhesive has a reflectance of 30% or higher at a wavelength in a range of at least 360 nm and at most 740 nm.
3. The anisotropic conductive adhesive according to claim 1 , wherein the base layer is made of a thin nickel film.
4. The anisotropic conductive adhesive according to claim 1 , wherein
the adhesive binder is thermally curable and has insulating properties, and
a weight ratio of the conductive panicles to the adhesive binder is in a range of from 1:100 to 100:100.
5. A light emitting device comprising an LED element adhered to a substrate by an anisotropic conductive adhesive,
wherein the LED element having a peak which is a maximum intensity of emitted light, positioned within a range of a wavelength at least 360 nm and at most 500 nm;
wherein the anisotropic conductive adhesive which includes conductive particles in an adhesive,
wherein each of the conductive particles includes
a resin particle,
a base layer formed on a surface of the resin particle by electrolytic plating method, and
a conductive light reflecting layer formed on a surface of the base layer by sputtering method, the conductive light reflecting layer containing Ag, Bi, and Nd, and
wherein the light reflecting layer is formed by sputtering of a sputtering target that contains Ag, Bi, and Nd with a content ratio of Bi set to at least 0.1 weight % and at most 3.0 weight % and a content ratio of Nd set to at least 0.1 weight % and at most 2.0 weight % with respect to a total weight of Ag, Bi, and Nd of 100 weight %.
6. An anisotropic conductive adhesive manufacturing method for manufacturing an anisotropic conductive adhesive by dispersing conductive particles in an adhesive,
wherein the conductive particles of the anisotropic conductive adhesive are formed by:
forming a base layer on resin particles, where the base layer forms on the resin particles by performing an electrolytic plating method on a surface of each resin particle; and
forming a light reflecting layer on a surface of the base layer by performing sputtering on a sputtering target that contains Ag, Bi, and Nd with a content ratio of Bi set to at least 0.1 weight % and at most 3.0 weight % and a content ratio of Nd set to at least 0.1 weight % and at most 2.0 weight % with respect to a total weight of Ag, Bi, and Nd of 100 weight %.