IP Library Granted Patent US 9,487,682
Granted Patent B2
US 9,487,682 · App. 14/009,417 · Granted Nov 8, 2016

Curable resin composition, cured product thereof, laminate, and method for producing laminate

Inventor: Kazunari Matsumura (Toyohashi, JP)
Assignee: Mitsubishi Rayon Co., Ltd.
C09J135/02B32B7/12B32B7/14C08F4/40C08F265/06Y10T428/31935
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Quick Facts
Patent No.
US 9,487,682
App. No.
14/009,417
Granted
Nov 8, 2016
Kind
B2
Abstract

This curable resin composition comprises (A) a polymerizable (meth)acrylic-based monomer, (B) a thiourea compound component, and (C) a peroxide component having a structure of formula (1), and may have (D) a (meth) acrylic-based polymer component as an optional component. (In formula (1), R is a C1-15 hydrocarbon group.) In the curable resin composition, preferably, the content of the (A) component is 5-100 mass % and the content of the (D) component is 0-95 mass % relative to the total mass of the (A) component and the (D) component.

Claims (48)

1. A curable resin composition comprising:

(A) a polymerizable (meth)acrylic-based monomer component;

(B) a thiourea compound component; and

(C) a peroxide component having a structure of the following formula (1),

wherein the composition may contain (D) a (meth)acrylic-based polymer component as an optional component,

wherein R in the formula (1) is a hydrocarbon group with a carbon number of 1 to 15.

2. The curable resin composition according to claim 1 , wherein

a content of the (A) component is 5 to 100 mass %, and

a content of the (D) component is 0 to 95 mass %,

relative to the total mass of the (A) component and the (D) component.

3. The curable resin composition according to claim 1 , wherein

a content of the (A) component is 80 to 100 mass %, and

a content of the (D) component is 0 to 20 mass %,

relative to the total mass of the (A) component and the (D) component.

4. The curable resin composition according to claim 1 , wherein

a content of the (A) component is 80 to 98 mass %, and

a content of the (D) component is 2 to 20 mass %,

relative to the total mass of the (A) component and the (D) component.

5. The curable resin composition according to claim 1 ,

wherein the (B) component is at least one compound selected from the group consisting of thiourea, ethylene thiourea, N,N′-dimethyl thiourea, N,N′-diethyl thiourea, N,N′-dipropyl thiourea, N,N′-di-n-butyl thiourea, N,N′-dilauryl thiourea, N,N′-diphenyl thiourea, trimethyl thiourea, 1-acetyl-2-thiourea and 1-benzoyl-2-thiourea; and

wherein the (C) component is at least one compound selected from the group consisting of t-hexylperoxy isopropyl monocarbonate, t-butylperoxy isopropyl monocarbonate, t-butylperoxy 2-ethylhexyl monocarbonate, t-butylperoxy allyl monocarbonate and 1,6-bis(t-butylperoxy carbonyloxy)hexane.

6. The curable resin composition according to claim 1 , comprising:

0.05 to 5 parts by mass of the (C) component; and

0.1 to 10 parts by mass of the (D) components,

relative to a total of 100 parts by mass of the (A) component and the (D) component.

7. The curable resin composition according to claim 6 ,

wherein the (B) component is at least one compound selected from the group consisting of thiourea, ethylene thiourea, N,N′-dimethyl thiourea, N,N′-diethyl thiourea, N,N′-dipropyl thiourea, N,N′-di-n-butyl thiourea, N,N′-dilauryl thiourea, N,N′-diphenyl thiourea, trimethyl thiourea, 1-acetyl-2-thiourea and 1-benzoyl-2-thiourea; and

wherein the (C) component is at least one compound selected from the group consisting of t-hexylperoxy isopropyl monocarbonate, t-butylperoxy isopropyl monocarbonate, t-butylperoxy 2-ethylhexyl monocarbonate, t-butylperoxy allyl monocarbonate and 1,6-bis(t-butylperoxy carbonyloxy)hexane.

8. A cured product obtained by curing the curable resin composition according to claim 1 .

9. A cured product obtained by curing the curable resin composition according to claim 5 .

10. A cured product obtained by curing the curable resin composition according to claim 6 .

11. A cured product obtained by curing the curable resin composition according to claim 7 .

12. A laminate comprising a layer consisting of the cured product according to claim 8 between two substrates.

13. A laminate comprising a layer consisting of the cured product according to claim 9 between two substrates.

14. A laminate comprising a layer consisting of the cured product according to claim 10 between two substrates.

15. A laminate comprising a layer consisting of the cured product according to claim 11 between two substrates.

16. A method for producing the laminate according to claim 12 , comprising:

pouring the curable resin composition according to claim 1 between two opposing substrates; and

curing the curable resin composition.

17. A method for producing the laminate according to claim 13 , comprising:

pouring the curable resin composition according to claim 5 between two opposing substrates; and

curing the curable resin composition.

18. A method for producing the laminate according to claim 14 , comprising:

pouring the curable resin composition according to claim 6 between two opposing substrates; and

curing the composition.

19. A method for producing the laminate according to claim 15 , comprising:

pouring the curable resin composition according to claim 7 between two opposing substrates; and

curing the curable resin composition.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 20, 2013
From: MATSUMURA, KAZUNARI
To: MITSUBISHI RAYON CO., LTD.
Reel/Frame 031830/0191 →
Priority Claims (1)
JP 2011-083622 · Apr 5, 2011 · national
Continuity (1)
Related Publication 20140120358A1 · May 1, 2014