Ceramic electronic component and manufacturing method thereof
A ceramic electronic component includes a ceramic body, an inner electrode, an outer electrode, and a connecting portion. The inner electrode is disposed inside the ceramic body. The end portion of the inner electrode extends to a surface of the ceramic body. The outer electrode is disposed on the surface of the ceramic body so as to cover the end portion of the inner electrode. The outer electrode includes a resin and a metal. The connecting portion is disposed so as to extend from an inside of the outer electrode to an inside of the ceramic body. In a portion of the surface of the ceramic body on which the outer electrode is disposed, the length of the connecting portion that extends in a direction in which the inner electrode is extends about 2.4 μm or more.
1. A ceramic electronic component comprising:
a ceramic body;
an inner electrode that is disposed inside the ceramic body and including an end portion extending towards a surface of the ceramic body, the inner electrode includes a metal;
an outer electrode layer that is disposed directly on the surface of the ceramic body so as to directly cover the end portion of the inner electrode, the outer electrode layer includes a thermosetting resin and a metal; and
a connecting portion disposed so as to extend from an inside of the outer electrode layer to an inside of the ceramic body; wherein
in a portion of the surface of the ceramic body on which the outer electrode layer is directly disposed, a length of the connecting portion that extends in a direction in which the inner electrode extends is 2.4 μm or more;
the connecting portion includes an alloy including both of a same metal as the metal included in the outer electrode layer and a same metal as the metal included in the inner electrode;
the metal included in the outer electrode layer is provided between the connecting portion and at least one other connecting portion, such that the connecting portion and the at least one other connecting portion are connected by the metal included in the outer electrode layer;
the connecting portion extends from inside the ceramic body to outside the ceramic body at the surface of the ceramic body to which the end portion of the inner electrode extends towards;
a portion of the connecting portion located outside the ceramic body at the surface of the ceramic body is wider than a portion of the connecting portion located inside the ceramic body at the surface of the ceramic body; and
a portion of the thermosetting resin included in the outer electrode layer is directly in contact with the surface of the ceramic body.
2. The ceramic electronic component according to claim 1 , wherein the outer electrode layer includes a first metal component and a second metal component having a higher melting point than the first metal component.
3. The ceramic electronic component according to claim 2 , wherein the first metal component contains Sn and the second metal component contains Ag.
4. The ceramic electronic component according to claim 3 , wherein the inner electrode contains Ni and the connecting portion contains a Sn—Ni alloy.
5. The ceramic electronic component according to claim 1 , wherein a width of a portion of the connecting portion located in the outer electrode layer is larger than a width of a portion of the connecting portion located in the ceramic body.
6. A ceramic electronic component comprising:
a ceramic body;
an inner electrode that is disposed inside the ceramic body and including an end portion extending towards a surface of the ceramic body, the inner electrode includes a metal;
an outer electrode layer that is disposed directly on the surface of the ceramic body so as to directly cover the end portion of the inner electrode, the outer electrode layer includes a thermosetting resin and a metal; and
a connecting portion disposed so as to extend from an inside of the outer electrode layer to an inside of the ceramic body; wherein
the connecting portion includes both of a same metal as the metal included in the outer electrode layer and a same metal as the metal included in the inner electrode;
the metal included in the outer electrode layer is provided between the connecting portion and at least one other connecting portion, such that the connecting portion and the at least one other connecting portion are connected by the metal included in the outer electrode layer;
the connecting portion is disposed so as to extend from an inside of the outer electrode layer to an end portion of the inner electrode inside of an end surface of the ceramic body;
the connecting portion extends from inside the ceramic body to outside the ceramic body at the surface of the ceramic body to which the end portion of the inner electrode extends towards;
a portion of the connecting portion located outside the ceramic body at the surface of the ceramic body is wider than a portion of the connecting portion located inside the ceramic body at the surface of the ceramic body; and
a portion of the thermosetting resin included in the outer electrode layer is directly in contact with the surface of the ceramic body.