IP Library Granted Patent US 9,490,061
Granted Patent B2
US 9,490,061 · App. 14/984,776 · Granted Nov 8, 2016

Coil component and board having the same

Inventors: Jong Ik Park (Suwon-Si, KR); Jin Mo Ahn (Suwon-Si, KR)
Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
H01F27/2804H01F27/292H05K1/181H05K2201/1003
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Quick Facts
Patent No.
US 9,490,061
App. No.
14/984,776
Granted
Nov 8, 2016
Kind
B2
Abstract

A coil component includes a magnetic body including first and second coil patterns disposed on first surfaces of two substrates spaced apart from each other and third and fourth coil patterns disposed on second surfaces of the two substrates, respectively, the substrates having respective cores; and first to fourth external electrodes disposed on outer surfaces of the magnetic body and connected to the first to fourth coil patterns, respectively. A gap member is disposed between the two substrates and in a central portion of the magnetic body in a thickness direction thereof.

Claims (28)

1. A coil component comprising:

a magnetic body including first and second coil patterns disposed on first surfaces of two substrates spaced apart from each other and third and fourth coil patterns disposed on second surfaces of the two substrates, respectively, the substrates having respective cores; and

first to fourth external electrodes disposed on outer surfaces of the magnetic body and connected to the first to fourth coil patterns, respectively,

wherein a gap member is disposed between the two substrates and in a central portion of the magnetic body in a thickness direction thereof.

2. The coil component of claim 1 , wherein the gap member has a shape of a bar and extends to both side surfaces of the magnetic body in a width direction thereof.

3. The coil component of claim 1 , wherein the gap member is an electroplated material.

4. The coil component of claim 1 , wherein the gap member is made of the same material as that of the first to fourth coil patterns.

5. The coil component of claim 1 , wherein a protrusion part is disposed on a side surface of at least one of the two substrates.

6. The coil component of claim 1 , wherein the first and second external electrodes are input terminals, and

the third and fourth external electrodes are output terminals.

7. The coil component of claim 1 , wherein the first to fourth coil patterns contain at least one selected from the group consisting of gold (Au), silver (Ag), platinum (Pt), copper (Cu), nickel (Ni), palladium (Pd), and alloys thereof.

8. The coil component of claim 1 , wherein the substrate is a magnetic substrate.

9. A board, comprising:

a printed circuit board on which a plurality of electrode pads are disposed; and

a coil component mounted on the printed circuit board,

wherein the coil component includes:

a magnetic body including first and second coil patterns disposed on first surfaces of two substrates spaced apart from each other and third and fourth coil patterns disposed on second surfaces of the two substrates, respectively; and

first to fourth external electrodes disposed on outer surfaces of the magnetic body and connected to the first to fourth coil patterns, respectively,

the substrates have respective cores, and

a gap member is disposed between the two substrates and in a central portion of the magnetic body in a thickness direction thereof.

10. The board of claim 9 , wherein the gap member has a shape of a bar and extends to both side surfaces of the magnetic body in a width direction thereof.

11. The board of claim 9 , wherein the gap member is an electroplated material.

12. The board of claim 9 , wherein the gap member is made of the same material as that of the first to fourth coil patterns.

13. The board of claim 9 , wherein a protrusion part is disposed on a side surface of at least one of the two substrates.

14. The board of claim 9 , wherein the first and second external electrodes are input terminals, and

the third and fourth external electrodes are output terminals.

15. The board of claim 9 , wherein the first to fourth coil patterns contain at least one selected from the group consisting of gold (Au), silver (Ag), platinum (Pt), copper (Cu), nickel (Ni), palladium (Pd), and alloys thereof.

16. The board of claim 9 , wherein the substrate is a magnetic substrate.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 30, 2015
From: PARK, JONG IK; AHN, JIN MO
To: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Reel/Frame 037386/0334 →
Priority Claims (1)
KR 10-2015-0032395 · Mar 9, 2015 · national
Continuity (1)
Related Publication 20160268039A1 · Sep 15, 2016