Substrate treating apparatus and method
Provided is a substrate treating apparatus. The substrate treating apparatus includes a first unit, a second unit, a supply line connecting the first unit to the second unit to supply a supercritical fluid from the first unit to the second unit, a flow rate adjustment member disposed in the supply line, and a filter disposed in the supply line to remove foreign substances. The supply line disposed between the flow rate adjustment member and the filter is disposed to get out of a straight line.
1. A substrate treating apparatus comprising:
a first unit;
a second unit;
a supply line connecting the first unit to the second unit to supply a supercritical fluid from the first unit to the second unit;
a flow rate adjustment member disposed in the supply line; and
a filter disposed in the supply line to remove foreign substances,
wherein the supply line disposed between the flow rate adjustment member and the filter is disposed to get out of a straight line,
wherein the flow rate adjustment member comprises an orifice, and
wherein the supply line disposed between the orifice and the filter has a length greater than a length of the supply line disposed between the filter and the second unit.
2. The substrate treating apparatus of claim 1 , wherein the supply line disposed between the orifice and the filter is disposed in a zigzag shape.
3. The substrate treating apparatus of claim 1 , wherein the supply line disposed between the orifice and the filter has a length ranging from about 1 meter to about 5 meters.
4. The substrate treating apparatus of claim 3 , wherein the supply line disposed between the orifice and the filter has a diameter greater than that of the supply line disposed between the first unit and the orifice.
5. The substrate treating apparatus of claim 4 , wherein the orifice comprises a first orifice and a second orifice which are disposed in parallel to each other, and
the first orifice has a diameter different from that of the second orifice.
6. The substrate treating apparatus of claim 5 , wherein the first orifice has a diameter less than that of the second orifice.
7. The substrate treating apparatus of claim 2 , further comprising a heating member for heating the supply line disposed between the orifice and the filter.
8. The substrate treating apparatus of claim 7 , wherein the heating member comprises a heater that is disposed to surround the supply line disposed between the orifice and the filter.
9. The substrate treating apparatus of claim 8 , wherein the first unit comprises a supply tank for storing the supercritical fluid, and
the second unit comprises a process chamber in which a process is performed by using the supercritical fluid.
10. A substrate treating method for treating a substrate by using a supercritical fluid, the substrate treating method comprising:
supplying the supercritical fluid from a first unit to a second unit via a supply line;
adjusting a flow rate of the supercritical fluid in the supply line by a flow rate adjustment member; and
removing foreign substances contained in the supercritical fluid by a filter,
wherein the supply line disposed between the flow rate adjustment member and the filter is disposed to get out of a straight line,
wherein the flow rate adjustment member comprises an orifice, and
wherein the supply line disposed between the orifice and the filter has a length greater than a length of the supply line disposed between the filter and the second unit.
11. The substrate treating method of claim 10 , wherein the supply line disposed between the orifice and the filter is disposed in a zigzag shape.
12. The substrate treating method of claim 11 , wherein the supply line disposed between the orifice and the filter has a length ranging from about 1 meter to about 5 meters.
13. The substrate treating method of claim 12 , wherein the supply line disposed between the orifice and the filter has a diameter greater than that of the supply line disposed between the first unit and the orifice.
14. The substrate treating method of claim 12 , further comprising heating the supply line disposed between the orifice and the filter.
15. The substrate treating apparatus of claim 8 , wherein the heater is an in-line heater.
16. The substrate treating apparatus of claim 8 , wherein the heater is a regulator.
17. The substrate treating apparatus of claim 7 , wherein the heating member is a housing which surrounds the supply line disposed between the orifice and the filter.
18. The substrate treating apparatus of claim 1 , wherein the flow rate adjustment member includes a metering valve.
19. The substrate treating apparatus of claim 18 , wherein the supply line is disposed between the metering valve and the filter.
20. The substrate treating apparatus of claim 1 , wherein the supply line is a circulation line between the first unit and the second unit.