Coil unit for thin film inductor, manufacturing method of coil unit for thin film inductor, thin film inductor and manufacturing method of thin film inductor
Embodiments of the invention provide a coil unit for a thin film inductor, a manufacturing method of a coil unit for a thin film inductor, a thin film inductor, and a manufacturing method of a thin film inductor. According to an embodiment, there is provided a coil unit for a thin film inductor. The coil unit includes an insulator having a dual insulating layer of different materials, and coil patterns respectively embedded in upper and lower surfaces of the insulator. The coil patterns include a coil pattern formed of a plurality of plating layers.
1. A coil unit for a thin film inductor, comprising:
a first insulating layer;
a second insulating layer disposed on the first insulating layer;
a first coil pattern embedded in the first insulating layer; and
a second coil pattern embedded in the second insulating layer,
wherein a number of plating layers forming the first coil pattern is different from a number of plating layers forming the second coil pattern, and at least one of the first and second coil patterns is formed of three or more plating layers.
2. The coil unit for the thin film inductor according to claim 1 , wherein the first insulating layer is made of a mixture of prepreg and resin, and the second insulating layer is made of resin.
3. The coil unit for the thin film inductor according to claim 1 , wherein the first insulating layer is made of resin, and the second insulating layer is made of a mixture of prepreg and resin.
4. The coil unit for the thin film inductor according to claim 1 , further comprising:
a conductive via hole for electrically connecting the first coil pattern and the second coil pattern.
5. The coil unit for the thin film inductor according to claim 1 , wherein an insulating resist is formed in a portion of the first coil pattern, which is exposed from the lower surface of the first insulating layer, and a portion of the second coil pattern, which is exposed from the upper surface of the second insulating layer.
6. A thin film inductor, comprising:
a coil unit for a thin film inductor according to claim 1 ; and
a magnetic material bonded to at least one of the upper and lower surfaces of the coil unit for the thin film inductor.