IP Library Granted Patent US 9,524,928
Granted Patent B2
US 9,524,928 · App. 14/147,464 · Granted Dec 20, 2016

Power quad flat no-lead (PQFN) package having control and driver circuits

Inventors: Dean Fernando (Torrance, CA); Roel Barbosa (Sta. Rosa Laguna, PH); Toshio Takahashi (Rancho Palos Verdes, CA)
Assignee: Infineon Technologies Americas Corp.
H01L23/49575H01L23/4952H01L23/49513H01L23/49541H01L23/49548H01L23/49562H01L23/3107H01L24/29H01L24/32H01L24/45H01L24/48H01L24/49H01L24/73H01L2224/05554H01L2224/0603H01L2224/2929H01L2224/29101H01L2224/29339H01L2224/32245H01L2224/45015H01L2224/45144H01L2224/45147H01L2224/48091H01L2224/48137H01L2224/48247H01L2224/4903H01L2224/49111H01L2224/49113H01L2224/49171H01L2224/49175H01L2224/73265H01L2924/014H01L2924/0105H01L2924/01005H01L2924/01006H01L2924/01029H01L2924/01033H01L2924/01047H01L2924/01079H01L2924/01082H01L2924/1305H01L2924/13055H01L2924/13064H01L2924/13091H01L2924/3011H01L2924/30111
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Quick Facts
Patent No.
US 9,524,928
App. No.
14/147,464
Granted
Dec 20, 2016
Kind
B2
Abstract

According to an exemplary implementation, a power quad flat no-lead (PQFN) package includes a multi-phase power inverter, a control circuit, and a driver circuit. The driver circuit is configured to drive the multi-phase power inverter responsive to a control signal from the control circuit. The multi-phase power inverter, the control circuit, and the driver circuit are each situated on a PQFN leadframe of the PQFN package. The control circuit and the driver circuit can be in a common integrated circuit (IC). Furthermore, the control circuit can be configured to reconstruct at least two phase currents of the multi-phase power inverter from a combined phase current.

Claims (38)

1. A power quad flat no-lead (PQFN) package comprising:

a multi-phase power inverter, a control circuit, and a driver circuit;

said driver circuit configured to drive said multi-phase power inverter responsive to a control signal from said control circuit;

said multi-phase power inverter, said control circuit, and said driver circuit each being situated on a PQFN leadframe of said PQFN package;

said driver circuit connected to a phase output strip of said leadframe;

wherein said phase output strip extends from a phase output pad at a first edge of said PQFN package to a second edge on an opposite side of said PQFN package.

2. The PQFN package of claim 1 , wherein said control circuit and said driver circuit are in a single common integrated circuit (IC).

3. The PQFN package of claim 2 , wherein said single common IC is connected to said phase output strip and to another phase output strip of said leadframe.

4. The PQFN package of claim 1 , wherein said phase output strip is selected from the group consisting of a U-phase output strip, a V-phase output strip, and a W-phase output strip.

5. The PQFN package of claim 1 , wherein said control circuit is configured to reconstruct at least two phase currents of said multi-phase power inverter from a combined phase current.

6. The PQFN package of claim 1 , wherein said control circuit comprises a pulse width modulation circuit that is configured to generate said control signal.

7. The PQFN package of claim 1 , wherein said control circuit comprises a space vector modulation circuit that is configured to generate said control signal.

8. The PQFN package of claim 1 , comprising a voltage regulator for said control circuit and said driver circuit.

9. The PQFN package of claim 8 , wherein said voltage regulator is on a common IC with said control circuit and said driver circuit.

10. The PQFN package of claim 1 , wherein said PQFN package has a footprint of greater than 12 mm by 12 mm.

11. The PQFN package of claim 1 , wherein said PQFN package has a footprint of less than 12 mm by 12 mm.

12. A power quad flat no-lead (PQFN) package comprising:

a multi-phase power inverter and a single common integrated circuit (IC);

said single common IC configured to generate a control signal and to drive said multi-phase power inverter responsive to said control signal;

said multi-phase power inverter and said single common IC each being situated on a PQFN leadframe of said PQFN package;

said single common IC connected to a phase output strip of said leadframe;

wherein said phase output strip extends from a phase output pad at a first edge of said PQFN package to a second edge on an opposite side of said PQFN package.

13. The PQFN package of claim 12 , wherein said single common IC is connected to said phase output strip and to another phase output strip of said leadframe.

14. The PQFN package of claim 12 , wherein said common IC is configured to reconstruct at least two phase currents of said multi-phase power inverter from a combined phase current.

15. The PQFN package of claim 12 , wherein said common IC is configured to generate said control signal as a pulse width modulated (PWM) control signal.

16. The PQFN package of claim 12 , comprising a voltage regulator configured to power a control circuit and a driver circuit of said common IC.

17. The PQFN package of claim 12 , wherein said common IC comprises a voltage regulator configured to power a control circuit and a driver circuit of said common IC.

18. A power quad flat no-lead (PQFN) package comprising:

high side power switches, low side power switches, a control circuit, and a driver circuit;

said high side and low side power switches situated on a PQFN leadframe;

said driver circuit configured to drive said high side and low side power switches responsive to a control signal from said control circuit;

said driver circuit and said control circuit being situated on a same die pad of said PQFN leadframe;

said driver circuit connected to a phase output strip of said leadframe;

wherein said phase output strip extends from a phase output pad at a first edge of said PQFN package to a second edge on an opposite side of said PQFN package.

19. The PQFN package of claim 18 , wherein said control circuit and said driver circuit are in a single common integrated circuit (IC).

20. The PQFN package of claim 18 , further comprising a leadframe island situated on said phase output strip and die exposed on a bottom-side of said PQFN package.

21. The PQFN package of claim 18 , wherein said high side power switches comprise group III-V transistors.

22. The PQFN package of claim 18 , wherein said low side power switches comprise group III-V transistors.

Assignments (2)
MERGER AND CHANGE OF NAME Recorded Apr 13, 2016
From: INFINEON TECHNOLOGIES NORTH AMERICA CORP.; INTERNATIONAL RECTIFIER CORPORATION; INTERNATIONAL RECTIFIER CORPORATION
To: INFINEON TECHNOLOGIES AMERICAS CORP.
Reel/Frame 038463/0859 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 17, 2014
From: FERNANDO, DEAN; BARBOSA, ROEL; TAKAHASHI, TOSHIO
To: INTERNATIONAL RECTIFIER CORPORATION
Reel/Frame 031999/0544 →
Continuity (5)
Continuation In Part 13662244 · Oct 26, 2012
Continuation 13034519 · Feb 24, 2011
Provisional Application 61777341 · Mar 12, 2013
Provisional Application 61459527 · Dec 13, 2010
Related Publication 20140117517A1 · May 1, 2014