Electronic device
An electronic device includes a surface-mounted component and a mounting component on which the surface-mounted component is mounted, the surface-mounted component includes a first bump and a second bump, a cross-sectional area of which in an in-plane direction of a surface facing the mounting component is larger than that of the first bump, on the surface facing the mounting component, the mounting component includes a first pad that is soldered to the first bump and a second pad soldered to the second bump on the surface facing the surface-mounted component, and a ratio of an area of the second pad to the cross-sectional area of the second bump is larger than a ratio of an area of the first pad to the cross-sectional area of the first bump.
1. An electronic device comprising:
a surface-mounted component; and
a mounting component on which the surface-mounted component is mounted,
wherein the surface-mounted component includes a first bump and a second bump that are horizontally adjacent to each other, an area of an upper surface of the second bump in an in-plane direction of a surface facing the mounting component is larger than an area of an upper surface of the first bump in the in-plane direction of the surface facing the mounting component,
wherein the first bump has a circular cross section in the in-plane direction and the second bump has an elliptical cross section in the in-plane direction,
wherein the mounting component includes a first pad soldered to the first bump and a second pad soldered to the second bump on the surface facing the surface-mounted component, and
wherein a ratio of an area of a lower surface of the second pad to the area of the upper surface of the second bump in the in-plane direction is larger than a ratio of an area of a lower surface of the first pad to the area of the upper surface of the first bump in the in-plane direction.
2. The electronic device according to claim 1 , wherein the mounting component is a mounting board, and
wherein the second bump dissipates heat generated from the surface-mounted component to the mounting board.
3. The electronic device according to claim 1 , wherein the second pad includes a positioning mechanism configured to limit movement of the second bump to a range within the second pad and form a solder flow channel toward the outside of the range.
4. The electronic device according to claim 3 , wherein the positioning mechanism is a resist formed on an outer circumference of the range of the second pad.
5. The electronic device according to claim 3 , wherein the positioning mechanism is an opening formed on the outer circumference of the range of the second pad.
6. The electronic device according to claim 3 , wherein the positioning mechanism is formed along two opposite sides of the range in a long-side direction of the second pad.
7. The electronic device according to claim 6 , wherein the positioning mechanism is configured to form the flow channel on at least one side of the two opposite sides.
8. The electronic device according to claim 3 , wherein the positioning mechanism is formed on one side of the second pad closer to the first pad in a long-side direction of the second pad.
9. The electronic device according to claim 1 , wherein a length of a second cross-section comprising the surface-mounted component, the second bump, the solder, and the second pad, the second cross-section perpendicularly passing through the upper surface of the second bump, is the same as a length of a first cross-section comprising the surface-mounted component, the first bump, the solder, and the first pad, the first cross-section perpendicularly passing through the upper surface of the first bump.
10. The electronic device according to claim 1 , wherein the ratio of the area of the lower surface of the second pad to the area of the upper surface of the second bump is larger than the ratio of the area of the lower surface of the first pad to the area of the upper surface of the first bump only when a length of a second cross-section comprising the surface-mounted component and the second bump is larger than a length of a first cross-section comprising the surface mounted component and the first bump, the second cross-section perpendicularly passing through the upper surface of the second bump and the first cross-section perpendicularly passing through the upper surface of the first bump.
11. The electronic device according to claim 2 , wherein the second pad includes a positioning mechanism configured to limit movement of the second bump to a range within the second pad and form a solder flow channel toward the outside of the range.
12. The electronic device according to claim 4 , wherein the positioning mechanism is formed along two opposite sides of the range in a long-side direction of the second pad.
13. The electronic device according to claim 5 , wherein the positioning mechanism is formed along two opposite sides of the range in a long-side direction of the second pad.
14. The electronic device according to claim 4 wherein the positioning mechanism is formed on one side of the second pad closer to the first pad in a long-side direction of the second pad.
15. The electronic device according to claim 5 wherein the positioning mechanism is formed on one side of the second pad closer to the first pad in a long-side direction of the second pad.
16. The electronic device according to claim 6 wherein the positioning mechanism is formed on one side of the second pad closer to the first pad in a long-side direction of the second pad.
17. The electronic device according to claim 7 wherein the positioning mechanism is formed on one side of the second pad closer to the first pad in a long-side direction of the second pad.