Solar battery rectangular conductor, method for fabricating same and solar battery lead wire
A rectangular conductor for a solar battery and a lead wire for a solar battery, in which warping or damaging of a silicon crystal wafer is hard to occur at the time of bonding a connection lead wire even when a silicon crystal wafer is configured to have a thin sheet structure, can be provided. A conductor 1 having a volume resistivity equal to or less than 50 μΩ·mm, and a 0.2% yield strength value equal to or less than 90 MPa in a tensile test is formed into a rectangular conductor 10 for a solar battery having a rectangular cross section, and a surface of the rectangular conductor 10 for a solar battery is coated with a solder plating film 13 , to provide a lead wire 20 for a solar battery.
1. A solar battery module comprising:
a plurality of solar battery cells to be used for converting a solar energy into an electric energy, the plurality of solar battery cells being connected by a solar battery rectangular conductor comprising a volume resistivity equal to or less than 50 μΩ·mm, and a 0.2% yield strength value equal to or less than 90 MPa in a tensile test,
wherein the rectangular conductor is attached to the plurality of solar battery cells.
2. The solar battery module according to claim 1 , wherein the rectangular conductor comprises a conductor composed of one element selected from the group consisting of Cu, Al, Ag and Au.
3. A solar battery module comprising:
a plurality of solar battery cells to be used for converting a solar energy into an electric energy, the plurality of solar battery cells being connected by a solar battery lead wire, the solar battery lead wire comprising a solder plating film provided on at least a region or all of a surface of a rectangular conductor comprising a volume resistivity equal to or less than 50 μΩ·mm, and a 0.2% yield strength value equal to or less than 90 MPa in a tensile test,
wherein the lead wire is attached to the plurality of solar battery cells.
4. The solar battery module, according to claim 3 , wherein the solder plating film is composed of Sn—Ag—Cu based Pb free solder.