Method of manufacturing module
When forming a module 100 having a configuration in which a column-shaped connection terminal 11 , which forms an interlayer connection conductor, and an electronic component 102 are mounted on a wiring substrate 101 and sealed with a resin, the column-shaped connection terminal 11 which has a substantially T-shaped cross section and in which a first end portion has a larger diameter than a second end portion is prepared (the preparation step), an electronic component 102 is mounted on one main surface of the wiring substrate 101 and the connection terminal 11 is mounted on the one main surface in such a manner that the second end portion of the connection terminal 11 having a smaller diameter is connected to the wiring substrate 101 (the mounting step), and the electronic component 102 and the connection terminal 11 are sealed with a resin layer 103 (the sealing step).
1. A method of manufacturing a module comprising a wiring substrate, one or more column-shaped connection terminals forming an interlayer connection conductor, and one or more first electronic components, the column-shaped connection terminals and the first electronic components being mounted on the wiring substrate and sealed with a resin, the method comprising:
a providing step of providing one or more column-shaped connection terminals each having a substantially T-shaped cross section, a first end portion of each of the connection terminals having a larger diameter than a second end portion of each of the connection terminals;
a first mounting step of mounting one or more first electronic components on one main surface of the wiring substrate, and mounting the connection terminals on the one main surface of the wiring substrate in such a manner that the second end portion of each of the connection terminals having a smaller diameter is connected to the wiring substrate; and
a first sealing step of sealing the first electronic components and the connection terminals with a resin layer.
2. The method of manufacturing the module according to claim 1 ,
wherein in the providing step, the connection terminals are a plurality of connection terminals, and the first end portion of each of the plurality of connection terminals having a larger diameter is adhered to a support body having a magnetic force, and
wherein, in the first mounting step, the plurality of connection terminals adhered to the support body are mounted.
3. The method of manufacturing the module according to claim 2 , further comprising a step of polishing or grinding a surface of the resin layer subsequent to the first sealing step.
4. The method of manufacturing the module according to claim 2 , further comprising a removal step of removing the support body prior to the first sealing step.
5. The method of manufacturing the module according to claim 4 , further comprising a step of polishing or grinding a surface of the resin layer subsequent to the first sealing step.
6. The method of manufacturing the module according to claim 1 , further comprising a step of polishing or grinding a surface of the resin layer subsequent to the first sealing step.
7. The method of manufacturing the module according to claim 1 , wherein, in the step of polishing or grinding, in addition to polishing or grinding the surface of the resin layer, the first end portion of each of the connection terminals is polished or ground.
8. The method of manufacturing the module according to claim 1 , further comprising:
a second mounting step of mounting one or more second electronic components on another main surface of the wiring substrate; and
a second sealing step of sealing the second electronic components with a resin layer.
9. The method of manufacturing the module according to claim 8 ,
wherein in the second mounting step, the connection terminals are further mounted in such a manner that the second end portion of each of the connection terminals is connected to the other main surface of the wiring substrate.
10. The method of manufacturing the module according to claim 9 , further comprising a third mounting step of mounting one or more third electronic components in such a manner that the third electronic components are connected to the first end portion of each of the connection terminals mounted on the other main surface of the wiring substrate.