IP Library › Granted Patent US 9,547,091
Granted Patent B2
US 9,547,091 · App. 14/754,760 · Granted Jan 17, 2017

Detector module for an X-ray detector

Inventors: Thorsten Ergler (Erlangen, DE); Edgar Göderer (Forchheim, DE)
Assignee: SIEMENS AKTIENGESELLSCHAFT
G01T1/242G01T1/243G01T1/244
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Quick Facts
Patent No.
US 9,547,091
App. No.
14/754,760
Granted
Jan 17, 2017
Kind
B2
Abstract

A detector module is disclosed for an X-ray detector. In an embodiment, the detector module includes a number of sensor boards arranged adjacent to each other on a module support, each sensor board including, in a stack formation, a sensor layer having a sensor surface and a support ceramic by which the sensor layer is thermally coupled to the module support. A number of elements are arranged on the side of the support ceramic that faces the module support in a stack formation and at least one heating element is included which, in a plane of projection perpendicular to the stack formation, at least partially covers at least the area of the support ceramic that is free from the elements. An X-ray detector including a number of detector modules is also disclosed.

Claims (23)

1. A detector module for an X-ray detector comprising:

a number of sensor boards arranged adjacent to each other on a module support, each of the sensor boards including, in a stack formation,

a sensor layer including a sensor surface, and

a support ceramic, by which the sensor layer is thermally coupled to the module support, wherein a number of elements are arranged in a stack formation on a side of the support ceramic that faces the module support and wherein at least one heating element is included which, in a plane of projection perpendicular to the stack formation, at least partially covers at least an area of the support ceramic that is free from the elements.

2. The detector module of claim 1 , wherein the heating element is designed as a meander-shaped heating loop.

3. The detector module of claim 1 , wherein the heating element is arranged in a stack formation on at least one of a top and bottom of the support ceramic.

4. The detector module of claim 1 , wherein the heating element is embedded in a stack formation in the support ceramic.

5. The detector module of claim 1 , wherein at least one heat-conducting coating is arranged on the support ceramic.

6. The detector module of claim 5 , wherein a heat-conducting coating is arranged on a top of the support ceramic.

7. The detector module of claim 5 , wherein a heat-conducting coating is embedded in the support ceramic.

8. The detector module of claim 5 , wherein the at least one heat-conducting coating is made from one or more metals which are chosen from a group that includes copper, nickel, indium, tungsten, aluminum and gold.

9. The detector module of claim 1 , wherein a read unit is arranged in a stack formation between the sensor layer and the support ceramic.

10. The detector module of claim 1 , wherein the sensor layer comprises a direct-converting semi-conductor material.

11. An X-ray detector for imaging an object penetrated by X-ray radiation, comprising a plurality of detector modules, at least one of the plurality of detector modules being the detector module of claim 1 .

12. The X-ray detector of claim 11 , wherein the support ceramic is connected in a stack formation via the module support to an electronic sensor device.

13. The detector module of claim 2 , wherein the heating element is arranged in a stack formation on at least one of a top and bottom of the support ceramic.

14. The detector module of claim 13 , wherein the heating element is embedded in a stack formation in the support ceramic.

15. The detector module of claim 14 , wherein at least one heat-conducting coating is arranged on the support ceramic.

16. The detector module of claim 15 , wherein a heat-conducting coating is arranged on the top of the support ceramic.

17. The detector module of claim 2 , wherein the heating element is embedded in a stack formation in the support ceramic.

18. The detector module of claim 2 , wherein at least one heat-conducting coating is arranged on the support ceramic.

19. The detector module of claim 6 , wherein a heat-conducting coating is embedded in the support ceramic.

20. The detector module of claim 10 , wherein the direct-converting semi-conductor material is cadmium telluride (CdTe) or cadmium zinc telluride (CdZnTe).

Assignments (4)
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE PREVIOUSLY RECORDED AT REEL: 066088 FRAME: 0256. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Jan 17, 2024
From: SIEMENS HEALTHCARE GMBH
To: SIEMENS HEALTHINEERS AG
Reel/Frame 071178/0246 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 20, 2023
From: SIEMENS HEALTHCARE GMBH
To: SIEMENS HEALTHINEERS AG
Reel/Frame 066088/0256 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 23, 2017
From: SIEMENS AKTIENGESELLSCHAFT
To: SIEMENS HEALTHCARE GMBH
Reel/Frame 042478/0498 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 21, 2015
From: ERGLER, THORSTEN; GOEDERER, EDGAR
To: SIEMENS AKTIENGESELLSCHAFT
Reel/Frame 036841/0063 →
Priority Claims (1)
DE 10 2014 213 738 · Jul 15, 2014 · national
Continuity (1)
Related Publication 20160018536A1 · Jan 21, 2016