Electroless plating solution with at least two borane containing reducing agents
A solution for providing electroless deposition of a metal layer on a substrate is provided. A solvent is provided. A metal precursor is provided to the solvent. A first borane containing reducing agent is provided to the solvent. A second borane containing reducing agent is provided to the solvent, wherein the first borane containing reducing agent has a deposition rate of at least five times a deposition rate of the second borane containing reducing agent, and wherein the solution is free of nonborane reducing agents.
1. A solution for providing electroless deposition of a metal layer on a substrate, comprising:
a solvent;
a metal precursor;
a first borane containing reducing agent; and
a second borane containing reducing agent, wherein the first borane containing reducing agent has a deposition rate of at least two times a deposition rate of the second borane containing reducing agent, and wherein the solution is free of nonborane reducing agents.
2. The solution, as recited in claim 1 , wherein the metal precursor comprises at least one of a cobalt precursor, a nickel precursor, a copper precursor, an iron precursor or a palladium precursor.
3. The solution, as recited in claim 2 , wherein the metal precursor comprises a mixture of a cobalt precursor and a molybdenum precursor.
4. The solution, as recited in claim 3 , wherein the solvent is at last one of dimethyl sulfoxide (DMSO), ethylene glycol, ionic liquids, or water.
5. The solution, as recited in claim 4 , wherein the solution further comprises at least one of a complexing agent, a surfactant, or a pH adjustment agent.
6. The solution, as recited in claim 5 , wherein the first borane containing reducing agent is at least one of tert-butylamine borane, ammonia borane, dimethylsulfide borane, or dimethylamine borane (DMAB) and the second borane containing reducing agent is morpholine borane.
7. The solution, as recited in claim 5 , wherein the first borane containing reducing agent comprises borane dimethylamine and the second borane containing reducing agent comprises morpholine borane.
8. The solution, as recited in claim 2 , wherein the first borane containing reducing agent comprises borane dimethylamine and the second borane containing reducing agent comprises morpholine borane.
9. The solution, as recited in claim 1 , wherein the first borane containing reducing agent comprises borane dimethylamine and the second borane containing reducing agent comprises morpholine borane.
10. A solution for providing electroless deposition of a metal layer on a substrate, comprising:
a solvent;
a metal precursor;
borane dimethylamine; and
morpholine borane.
11. The solution, as recited in claim 10 , wherein the metal precursor comprises at least one of a cobalt precursor, a nickel precursor, a copper precursor, an iron precursor or a palladium precursor.
12. The solution, as recited in claim 11 , wherein the metal precursor comprises a mixture of a cobalt precursor and a molybdenum precursor.
13. The solution, as recited in claim 12 , wherein the solvent is at last one of dimethyl sulfoxide (DMSO), ethylene glycol, ionic liquids, or water.
14. The solution, as recited in claim 1 , wherein the first borane containing reducing agent is at least one of tert-butylamine borane or dimethylsulfide borane and the second borane containing reducing agent is morpholine borane.