Reduction of resonance in connectors
Techniques for reducing resonance in contact fingers of a connector are described herein. An example of a device in accordance with the present techniques includes an add-in-card that includes a circuit board and an edge contact finger disposed on an outer surface of the circuit board. The add-in-card also includes a resonator disposed in an internal layer of the circuit board and coupled to the edge contact finger, wherein the resonator reduces a resonance in the edge contact finger.
1. An add-in-card, comprising:
a circuit board;
an edge contact finger disposed on an outer surface of the circuit board; and
a resonator disposed in an internal layer of the circuit board, the resonator electromagnetically coupled to the edge contact finger and conductively isolated within the internal layer of the circuit board from any other conductors, the resonator to reduce a resonance in the edge contact finger.
2. The add-in-card of claim 1 , wherein the resonator is conductively isolated from the edge contact finger by an insulative material.
3. The add-in-card of claim 1 , wherein the add-in-card is compliant with a PCIe Card Electromechanical Specification.
4. The add-in-card of claim 3 , wherein the resonator is disposed in the Metal 2 layer specified by the PCIe Card Electromechanical Specification.
5. The add-in-card of claim 1 , wherein the edge contact finger is a single-ground contact.
6. The add-in-card of claim 1 , wherein the resonator is a quarter-wave stub.
7. The add-in-card of claim 1 , wherein the edge contact finger is a ground contact and the resonator is further electromagnetically coupled to a signal or sideband contact finger adjacent to the ground contact.
8. The add-in-card of claim 1 , wherein the edge contact finger is a first ground contact and the resonator is further electromagnetically coupled to a second ground contact adjacent to the first ground contact.
9. The add-in-card of claim 8 , wherein the first ground contact and the second ground contact are conductively coupled to each other over a partial length of the first ground contact and the second ground contact.
10. A computing device, comprising:
a baseboard comprising a socket for receiving an add-in-card; and
an add-in-card inserted into the socket, the add-in-card comprising:
a circuit board;
an edge contact finger disposed on an outer surface of the circuit board; and
a resonator disposed in an internal layer of the circuit board, the resonator electromagnetically coupled to the edge contact finger and conductively isolated within the internal layer of the circuit board from any other conductors, the resonator to reduce a resonance in the edge contact finger.
11. The computing device of claim 10 , wherein the resonator is conductively isolated from the edge contact finger by an insulative material.
12. The computing device of claim 10 , wherein the add-in-card card is compliant with a PCIe Card Electromechanical Specification.
13. The computing device of claim 12 , wherein the resonator is disposed in the Metal 2 layer specified by the PCIe Card Electromechanical Specification.
14. The computing device of claim 10 , wherein the edge contact finger is a single-ground contact.
15. The computing device of claim 10 , wherein the resonator is a quarter-wave stub.
16. The computing device of claim 10 , wherein the edge contact finger is a ground contact and the resonator is further electromagnetically coupled to a signal contact finger adjacent to the ground contact.
17. The computing device of claim 10 , wherein the edge contact finger is a first ground contact and the resonator is further electromagnetically coupled a second ground contact adjacent to the first ground contact.
18. The computing device of claim 17 , wherein the first ground contact and the second ground contact are conductively coupled to each other over a partial length of the first ground contact and the second ground contact.
19. A method of manufacturing an electronic device, comprising:
disposing a resonator within an internal layer of the circuit board of the electronic device, the resonator positioned to be electromagnetically coupled to an edge contact finger;
disposing a conductively insulative material over the resonator so that the resonator will be conductively isolated within the internal layer of the circuit board from any other conductors; and
Disposing the edge contact finger on an outer surface of a circuit board, the resonator to reduce a resonance in the edge contact finger.
20. The method of claim 19 , wherein the edge contact finger is a ground contact, the method comprising coupling the resonator to the ground contact and a signal contact finger adjacent to the ground contact.
21. The method of claim 19 , wherein the edge contact finger is a first ground contact, the method comprising coupling the resonator to the first ground contact and a second ground contact adjacent to the first ground contact.
22. The method of claim 21 , comprising conductively coupling the first ground contact and the second ground contact to each other over a partial length of the first ground contact and the second ground contact.