IP Library Granted Patent US 9,563,233
Granted Patent B2
US 9,563,233 · App. 14/460,286 · Granted Feb 7, 2017

Electronic device with plated electrical contact

Inventors: Mark Thomas McCormack (Livermore, CA); Anthony Allen Fischer (Redmond, WA); Raj Master (San Jose, CA); Farah Shariff (Kirkland, WA); Dennis Tom (Redmond, WA); Zulfiqar Alam (Redmond, WA)
Assignee: MICROSOFT TECHNOLOGY LICENSING, LLC
G06F1/163C25D3/50C25D3/62C25D5/10C25D7/00G06F1/1684H01R13/03
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Quick Facts
Patent No.
US 9,563,233
App. No.
14/460,286
Granted
Feb 7, 2017
Kind
B2
Abstract

An electronic device includes an electronic component configured to receive electric current and a plated contact electrically coupled to the electronic component and configured to carry the electric current to the electronic component from a system external to the device. The plated contact includes a copper-alloy layer, a platinum-group metal (PGM) layer plated over the copper-alloy layer, and a gold-alloy layer plated over the PGM layer.

Claims (32)

1. An electronic device comprising:

an electronic component wearable on human skin and configured to receive electric current; and

a mechanically contactable plated electrical contact coupled to the electronic component and configured to carry the electric current to the electronic component from a system external to the electronic device, the plated electrical contact including:

a copper-alloy layer;

a platinum-group metal (PGM) layer plated over the copper-alloy layer; and

a gold-alloy layer plated over the PGM layer.

2. The electronic device of claim 1 , wherein the PGM layer is plated directly onto the copper-alloy layer.

3. The electronic device of claim 1 , wherein the PGM layer includes palladium.

4. The electronic device of claim 1 , wherein the PGM layer is a PGM-alloy layer.

5. The electronic device of claim 4 , wherein the PGM-alloy layer includes nickel.

6. The electronic device of claim 1 , wherein the gold-alloy layer is at least thirty microinches in thickness.

7. The electronic device of claim 1 , wherein the copper-alloy layer is a zinc-free bronze.

8. The electronic device of claim 1 , wherein the gold-alloy layer includes cobalt.

9. The electronic device of claim 1 , wherein the gold-alloy layer is plated directly onto the PGM layer.

10. The electronic device of claim 1 , wherein the PGM layer is a first PGM layer, the plated contact further comprising one or more additional PGM layers arranged between the first PGM layer and the gold-alloy layer.

11. The electronic device of claim 10 , wherein each of the additional PGM layers is arranged over an underlying gold layer.

12. The electronic device of claim 11 , wherein each of the additional PGM layers is plated directly onto the underlying gold layer.

13. The electronic device of claim 10 , wherein the gold-alloy layer and each underlying gold layer is plated directly onto the PGM layer directly beneath it.

14. The electronic device of claim 10 , wherein each underlying gold layer is a substantially pure gold layer.

15. A method comprising:

coupling a copper-alloy layer to an electronic component of an electronic device, the electronic component wearable on human skin and configured to receive electric current;

plating a platinum-group metal (PGM) layer over the copper-alloy layer to form a mechanically contactable plated electrical contact, the plated contact being coupled to the electronic component and configured to carry the electric current to the electronic component from a system external to the electronic device; and

plating a gold-alloy layer over the PGM layer.

16. The method of claim 15 , wherein said plating includes electroplating.

17. The method of claim 15 , wherein said plating includes electroless deposition, chemical vapor deposition, and/or evaporative deposition.

18. An electronic device to be worn on human skin, the electronic device comprising:

an electronic component wearable on human skin and configured to receive electric current; and

a mechanically contactable plated electrical contact coupled to the electronic component and configured to carry the electric current to the electronic component from a system external to the electronic device, the plated electrical contact including:

a copper-alloy layer;

a platinum-group metal (PGM) layer plated directly onto the copper-alloy layer; and

a gold-alloy layer plated directly onto the PGM layer.

19. The electronic device of claim 18 , wherein the copper-alloy layer includes an aluminum bronze, silicon bronze, and/or phosphor bronze, and wherein the gold-alloy layer is at least thirty microinches in thickness.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 9, 2015
From: MICROSOFT CORPORATION
To: MICROSOFT TECHNOLOGY LICENSING, LLC
Reel/Frame 039025/0454 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 7, 2014
From: MCCORMACK, MARK THOMAS; FISCHER, ANTHONY ALLEN; MASTER, RAJ; SHARIFF, FARAH; TOM, DENNIS; ALAM, ZULFIQAR
To: MICROSOFT CORPORATION
Reel/Frame 034130/0909 →
Continuity (1)
Related Publication 20160048159A1 · Feb 18, 2016