Method of manufacturing semiconductor devices
A substrate having an insulating layer including an oxide is loaded into a chamber, and at least a part of the insulating layer is removed by injecting a process gas including an etching source gas into the chamber. The removal process is performed in a pulse type in which a first period and a second period are repeated a plurality of times. The etching source gas is supplied at a first flow rate during the first period and is supplied at a second flow rate less than the first flow rate during the second period. A temperature of the inside of the chamber remains at 100° C. or more during the removal process.
1. A method of manufacturing a semiconductor device comprising:
loading a substrate into a chamber, on which an insulating layer comprising an oxide is formed; and
injecting a process gas comprising an etching source gas into the chamber to remove at least a portion of the insulating layer,
wherein the process of removing at least a portion of the insulating layer is performed in a pulse type in which a first period and a second period are repeated a plurality of times,
wherein the etching source gas is supplied at a first flow rate during the first period and is supplied at a second flow rate less than the first flow rate during the second period,
wherein a temperature of the inside of the chamber remains at 100° C. or more during the process of the removing the portion of the insulating layer,
wherein a pressure of the process gas in the chamber during the first and second periods is changed in such a way that a third period and a fourth period are alternately repeated, and
wherein the pressure of the process gas in the chamber remains at a first pressure during the third period and remains at a second pressure lower than the first pressure during the fourth period.
2. The method of manufacturing a semiconductor device of claim 1 , wherein the second period is an off state in which supply of the etching source gas is interrupted such that the supply of the etching source gas is repeatedly tumed-on and turned-off during the process of removing the at least a portion of the insulating layer.
3. The method of manufacturing a semiconductor device of claim 1 , wherein the second period is longer than the first period.
4. The method of manufacturing a semiconductor device of claim 3 , wherein the second period is from 3 to 15 times as long as the first period.
5. The method of manufacturing a semiconductor device of claim 3 , wherein the first period ranges from 1 second to 20 seconds, and the second period ranges from 5 seconds to 60 seconds.
6. The method of manufacturing a semiconductor device of claim 1 , wherein sublimation of etching by-products generated while the insulating layer is removed, proceeds during the second period.
7. The method of manufacturing a semiconductor device of claim 1 , wherein the process gas is supplied into the chamber in a gas state that does not become plasma, or by a remote plasma method.
8. The method of manufacturing a semiconductor device of claim 1 , wherein the etching source gas comprises HF and NH 3 or comprises at least two of NF 3 , NH 3 , HF or H 2 .
9. The method of manufacturing a semiconductor device of claim 1 , wherein the process gas is purged during the fourth period.
10. The method of manufacturing a semiconductor device of claim 1 , wherein a start point and an end point of the third period is the same as a start point and an end point of the first period, respectively, and
wherein a start point and an end point of the fourth period is the same as a start point and an end point of the second period, respectively.
11. The method of manufacturing a semiconductor device of claim 1 , wherein a start point and an end point of the third period are later than a start point and an end point of the first period, respectively, and
wherein a start point and an end point of the fourth period are later than a start point and an end point of the second period, respectively.
12. A dry cleaning method comprising:
loading a substrate into a chamber, on which an insulating layer comprising an oxide is formed; and
removing at least a portion of the insulating layer by injecting a process gas comprising an etching source gas into the chamber,
wherein the process of removing at least a portion of the insulating layer is performed in a pulse type in which a first period comprising an on-state and a second period comprising an off-state of supplying of the etching source gas are alternately repeated a plurality of times,
wherein a temperature of the inside of the chamber remains at 100° C. or more during the process of removing the at least a part of the insulating layer,
wherein a pressure of the process gas in the chamber during the first and second periods is changed in such a way that a third period and a fourth period are alternately repeated, and
wherein the pressure of the process gas in the chamber remains at a first pressure during the third period and remains at a second pressure lower than the first pressure during the fourth period.
13. The dry cleaning method of claim 12 , wherein a pulse interval corresponding to the on-state of the supplying of the etching source gas is less than a pulse interval corresponding to the off-state of the supplying of the etching source gas.
14. The dry cleaning method of claim 12 , wherein a temperature of the inside of the chamber remains at 200° C. or less during the process of removing at least a portion of the insulating layer.
15. The dry cleaning method of claim 12 , wherein sublimation, of etching by-products generated while the insulating layer is removed, proceeds during the off-state.
16. The dry cleaning method of claim 12 , wherein the process gas is purged during the off-state.
17. The dry cleaning method of claim 12 , wherein the etching source gas comprises HF and NH 3 or comprises at least two of NF 3 , NH 3 , HF or H 2 .
18. A method of manufacturing a semiconductor device corn prising:
forming a first layer and a second layer comprising a material having an etch selectivity with respective to the first layer, on a substrate, the first layer comprising an insulating material and horizontally adjacent to the second layer; and
removing at least a portion of the first layer,
wherein the process of removing the at least a portion of the first layer comprises:
loading a substrate on which the first and second layers are formed, into a chamber; and
supplying a process gas comprising an etching source gas into the chamber in a pulse type in which a first period and a second period are repeated a plurality of times,
wherein the etching source gas is supplied at a first flow rate during the first period and is supplied at a second flow rate less than the first flow rate during the second period,
wherein a temperature of the inside of the chamber remains at 100° C. or more during the removing, the at least a part of the first layer,
wherein a pressure of the process gas in the chamber during the first and second periods is changed in such a way that a third and a fourth period are alternately repeated, and
wherein the pressure of the process gas in the chamber remains at a first pressure during the third period and remains at a second pressure lower than the first pressure during the fourth period.
19. The method of manufacturing a semiconductor device of claim 18 , wherein a start point and an end point of the third period is the same as a start point and an end point of the first period, respectively, and
wherein a start point and an end point of the fourth period is the same as a start point and an end point of the second period, respectively.
20. The method of manufacturing a semiconductor device of claim 18 , wherein a start point and an end point of the third period are later than a start point and an end point of the first period, respectively, and
wherein a start point and an end point of the fourth period are later than a start point and an end point of the second period, respectively.