IP Library › Granted Patent US 9,565,795
Granted Patent B2
US 9,565,795 · App. 14/816,391 · Granted Feb 7, 2017

Receptacle assembly and module assembly

Inventors: Yosuke Takai (Tokyo, JP); Toshiyasu Ito (Tokyo, JP)
Assignee: Yamaichi Electronics Co., Ltd.
H05K9/0015G02B6/4277H04Q1/14H05K7/1461H05K7/20545H05K9/0062G02B6/4284H05K1/141H05K2201/10189
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Quick Facts
Patent No.
US 9,565,795
App. No.
14/816,391
Granted
Feb 7, 2017
Kind
B2
Abstract

In a receptacle assembly, a module is guided by a guide rail and held inside an opening of a printed wiring board when a plug connector of the module is connected to a host connector.

Claims (32)

1. A receptacle assembly comprising:

a guide member provided on the periphery of an opening of a wiring board which has the opening, and configured to form a module accommodation portion to detachably accommodate a module comprising a module board, and configured to guide the module;

a connector unit provided on the wiring board at a position adjacent to the module accommodation portion, and configured to electrically connect the module board of the module to the wiring board;

a first EMI gasket sealing a gap between a lower end portion of a connector cover covering the connector unit and the wiring board; and

a second EMI gasket sealing a gap between a connecting end portion of the module and the periphery of an opening of the connector unit when the module is placed to the module accommodation portion through the opening of the connector unit, wherein

when the module is accommodated by the module accommodation portion, a position of a lower end portion of the module is positioned at a position lower than a position of the wiring board through an opening of the wiring board.

2. The receptacle assembly according to claim 1 , further comprising:

a bracket to form a guide slot of the accommodation portion to allow passage of the module, wherein

the bracket blocks entry of the module when the module in an incorrect position is about to be placed to the module accommodation portion.

3. The receptacle assembly according to claim 2 , wherein

a shape of the guide slot of the bracket corresponds to a cross-sectional shape of the module so as to allow passage of the module,

the guide slot includes a first recessed portion, a second recessed portion, and a third recessed portion communicating with the first recessed portion via the second recessed portion, and

a width dimension of the first recessed portion in an orthogonal direction to a direction of placement of the module is different from a width dimension of the third recessed portion.

4. The receptacle assembly according to claim 2 , wherein

a shape of the guide slot of the bracket corresponds to a cross-sectional shape of the module so as to allow passage of the module,

the guide slot includes a first recessed portion, a second recessed portion, and a third recessed portion communicating with the first recessed portion via the second recessed portion, and

an engagement piece, which is to be engaged with a groove formed at a predetermined position on an outer peripheral portion of the module, is formed on the periphery of the third recessed portion.

5. The receptacle assembly according to claim 2 , wherein

a shape of the guide slot of the bracket corresponds to a cross-sectional shape of the module so as to allow passage of the module,

the guide slot includes a first recessed portion, a second recessed portion, and a third recessed portion communicating with the first recessed portion via the second recessed portion, and

an engagement piece, which is to be engaged with a corner portion formed at a predetermined position on an outer peripheral portion of the module, is formed on the periphery of the third recessed portion.

6. A module assembly comprising:

a module including a module board having a connecting end portion located on one end portion of the module board; and

the receptacle assembly according to claim 2 .

7. The receptacle assembly according to claim 1 , further comprising:

a heat sink body having a heat-dissipation portion provided adjacent to an outer peripheral portion of the guide member, the heat sink body being provided across the guide member.

8. A module assembly comprising:

a module including a module board having a connecting end portion located on one end portion of the module board; and

the receptacle assembly according to claim 7 .

9. A module assembly comprising:

a module including a module board having a connecting end portion located on one end portion of the module board; and

the receptacle assembly according to claim 1 .

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 3, 2015
From: TAKAI, YOSUKE; ITO, TOSHIYASU
To: YAMAICHI ELECTRONICS CO., LTD.
Reel/Frame 036238/0028 →
Priority Claims (1)
JP 2014-158998 · Aug 4, 2014 · national
Continuity (1)
Related Publication 20160037642A1 · Feb 4, 2016